Reference
Suppliers
What each of the 226 firms makes, where it is based, and how hard it would be to replace.
The interactive page adds a map of the route one chip takes, a drawing of which countries supply which stages, search and filters.
Revenue is each company's latest annual figure as filed, in the currency and unit of its own report. For a company that does not report in US dollars, the dollar figure is converted at the average of the Federal Reserve's monthly exchange rates over the company's fiscal year (release G.5).
IP & Architecture5 firms · 1 critical
IP & ArchitectureArm Holdings
CPU instruction set and core IP
Licenses the CPU architecture and cores used in the host processors that feed data to AI accelerators. These include Nvidia's Grace and Vera CPUs and the Arm cores inside the server chips that large cloud companies design. It also licenses the interconnect and system IP around them. In 2026 it launched the Arm AGI CPU, its first production chip. By May 2026, ASRock, Lenovo, Quanta and Supermicro were taking orders for servers built on it.
- Customers
- Nvidia, Amazon, Google, Microsoft, MediaTek, Qualcomm
- Founded
- 1990
- Ownership
- Public, majority owned by SoftBank Group
- Revenue
- $4,920 million (year to March 2026)
Alphawave Semi
High-speed SerDes and chiplet connectivity IP
Supplies multi-gigabit connection IP (SerDes, PCIe, UCIe and Ethernet) that moves data between chiplets and between accelerators. Qualcomm bought it to build data-center silicon.
- Customers
- Qualcomm, Arm, Marvell, Intel
- Founded
- 2017
- Ownership
- Acquired by Qualcomm in a deal announced in 2025 and no longer separately listed
- Revenue
- $254,475 thousand (2025)
About the revenue figure. Alphawave is now part of Qualcomm. The figure comes from its 2025 accounts filed at Companies House.
Rambus
Memory interface IP and controllers
Licenses the memory controller and interface (PHY) IP that connects a processor to DDR5, LPDDR and HBM memory. It also sells register clock drivers, the buffer chips on server memory modules.
- Customers
- Nvidia, AMD, Micron, Samsung, SK hynix
- Founded
- 1990
- Ownership
- Public
- Revenue
- $707,630 thousand (2025)
Imagination Technologies
GPU and neural accelerator IP
Licenses GPU and neural network accelerator IP for edge and automotive silicon. Its ownership by a China-linked fund made it an early test case for technology transfer scrutiny in the UK.
- Customers
- MediaTek, Renesas, Texas Instruments
- Founded
- 1985
- Ownership
- Private, owned by Canyon Bridge Capital Partners
SiFive
RISC-V processor IP
Sells RISC-V CPU cores, including vector and matrix cores used as control processors inside AI accelerators. RISC-V is the license-free alternative to Arm, and Chinese chip designers are adopting it heavily.
- Customers
- Google, Meta, Renesas, Tenstorrent
- Founded
- 2015
- Ownership
- Private, venture-backed
Lithography6 firms · 2 critical
LithographyASML
EUV and immersion DUV scanners
The only maker of extreme ultraviolet (EUV) lithography scanners, the machines that print circuit patterns onto wafers. It also makes immersion deep ultraviolet (DUV) scanners. Chipmakers use its EUV systems for the most critical layers on the most advanced logic and memory chips.
- Customers
- TSMC, Samsung, Intel, SK hynix, Micron, Rapidus
- Share
- Only manufacturer of EUV lithography systems. Recognized revenue on 48 EUV systems and 279 DUV systems in 2025
- Founded
- 1984
- Ownership
- Public
- Revenue
- €32,667.3 million (2025), about $36.9 billion
- From China
- 29.1% of revenue, FY2025
Cymer
DUV excimer light sources and EUV tin plasma sources
Builds the light sources for lithography: excimer lasers for DUV scanners and the laser-produced tin plasma source that generates 13.5 nm EUV light. The EUV source is the hardest subsystem in the machine.
- Customers
- ASML
- Founded
- 1986
- Ownership
- Subsidiary of ASML since 2013
Canonキヤノン株式会社
i-line and KrF steppers, nanoimprint lithography
Makes i-line and KrF steppers for mature nodes and packaging. It is also commercializing nanoimprint lithography, which stamps a pattern into the resist. Nanoimprint needs no EUV optics, but it has defect and throughput limits.
- Customers
- Kioxia, Toshiba, Packaging and mature-node fabs
- Founded
- 1937
- Ownership
- Public
- Revenue
- ¥4,624,727 million (2025), about $30.9 billion
Gigaphotonギガフォトン株式会社
Excimer lasers for DUV lithography
Makes ArF and KrF excimer laser light sources for DUV scanners, including ASML immersion tools. It describes itself as the world's leading excimer laser light source manufacturer. It also offers retrofit sources for installed DUV tools.
- Customers
- Nikon, Canon, Fabs with installed DUV tools
- Founded
- 2000
- Ownership
- Subsidiary of Komatsu
Nikon株式会社ニコン
ArF immersion, ArF and KrF scanners, i-line steppers, digital lithography
Makes ArF immersion, ArF, KrF and i-line lithography systems. It now has a small share of the leading-edge market. But its tools are still used to make chips on older (mature-node) processes, and Nikon services them. Its current lineup includes no EUV system.
- Customers
- Intel, Kioxia, Renesas, Chinese mature-node fabs
- Founded
- 1917
- Ownership
- Public
- Revenue
- ¥677,163 million (year to March 2026), about $4.49 billion
SMEE上海微电子装备
Domestic Chinese lithography scanners
A Chinese maker of lithography scanners, founded in 2002 in Shanghai's Zhangjiang park. It ships i-line and KrF class tools for packaging and mature nodes. Reports of a domestic immersion ArF tool in production have not been independently confirmed.
- Customers
- SMIC, Chinese packaging houses, Chinese mature-node fabs
- Founded
- 2002
- Ownership
- State-owned, backed by the Shanghai municipal government and the National IC Fund
Design & EDA7 firms · 3 critical
Design & EDACadence Design Systems
Digital and analog implementation, verification, IP
The second-largest of the three main makers of chip design (EDA) software, strong in analog and custom design, simulation and hardware emulation. Designers verify large AI chips on its Palladium and Protium emulation systems, which run a design in hardware before it goes to the fab.
- Customers
- Nvidia, Broadcom, Marvell, MediaTek, Samsung, Micron
- Share
- About $5.30B of calendar 2025 EDA revenue, second behind Synopsys
- Founded
- 1988
- Ownership
- Public
- Revenue
- $5,296,759 thousand (2025)
- From China
- 12.8% of revenue, FY2025
Siemens EDA
Design for test, physical verification, Calibre
The third-largest maker of chip design (EDA) software. Its Calibre tool is the de facto standard for physical verification, the check foundries use to confirm a layout follows their manufacturing rules before they accept it. It also sells design-for-test software. Foundries write the rule files they give chip designers in Calibre's format.
- Customers
- TSMC, Samsung, Intel, GlobalFoundries, Nvidia
- Share
- Estimated $2.2-2.5B of calendar 2025 EDA revenue, third behind Synopsys and Cadence. The EDA country share counts it under Germany, its parent's home
- Founded
- 1981
- Ownership
- Subsidiary of Siemens AG of Germany (acquired as Mentor Graphics in 2017)
Synopsys
Full-flow EDA, silicon IP and simulation
Makes the synthesis, place-and-route, verification and signoff software that turns the code describing an AI accelerator's logic (its RTL) into a layout a fab can build. It also sells the largest commercial catalog of silicon IP, ready-made circuit blocks that chip designers license. Its 2025 acquisition of Ansys added multiphysics simulation for thermal and power integrity.
- Customers
- Nvidia, AMD, Apple, TSMC, Samsung, Intel
- Share
- About $8B of calendar 2025 EDA and IP revenue including Ansys, against Cadence at $5.30B and Siemens EDA at an estimated $2.2-2.5B
- Founded
- 1986
- Ownership
- Public
- Revenue
- $7,054,178 thousand (year to October 2025)
- From China
- 11.5% of revenue, year to Oct 2025
Ansys
Multiphysics, thermal and power integrity simulation
Makes the thermal, electromagnetic and structural simulation software used to model how a 1 kW accelerator package heats, warps and delivers power. Its RedHawk tool is the standard for power integrity signoff, the final check that power reaches every part of a chip as designed.
- Customers
- Nvidia, AMD, TSMC, Samsung, Intel
- Founded
- 1970
- Ownership
- Subsidiary of Synopsys since the acquisition closed in 2025
- Revenue
- $2,544,809 thousand (2024)
About the revenue figure. Ansys has filed no accounts since Synopsys bought it in July 2025, so this is its last annual figure.
Empyrean Technology华大九天
Analog and flat-panel EDA, China domestic substitution
A Chinese EDA vendor. In its 2025 annual report, filed in April 2026, it says it has complete design tool chains for analog, memory, radio-frequency and flat-panel display circuits. The same report says its digital tools cover 80 percent of the main tools for digital design. It is the main company in China's effort to replace the American EDA tools that export controls can cut off.
- Customers
- SMIC, Hua Hong, CXMT, BOE
- Founded
- 2009
- Ownership
- Public, with state-linked shareholders including China Electronics Corporation
- Revenue
- CN¥1,324,976,566.63 (2025), about $184 million
Primarius Technologies概伦电子
Device modeling, SPICE simulation and DTCO
A Chinese EDA vendor that makes device modeling, parameter extraction and fast SPICE circuit simulation software. Device models describe how the transistors on a foundry's process behave, so chip designers can simulate their circuits on that process.
- Customers
- SMIC, Hua Hong, CXMT, Samsung
- Founded
- 2010
- Ownership
- Public (Shanghai STAR Market)
- Revenue
- CN¥483,670,553.41 (2025), about $67.3 million
Semitronix杭州广立微
Yield-analysis EDA and test chips
Supplies test-chip design software, on-wafer electrical test systems and yield analysis tools used to measure and debug a new manufacturing process. Its products fall between design software and metrology (measurement) equipment.
- Customers
- SMIC, Hua Hong, CXMT, Nexchip
- Founded
- 2003
- Ownership
- Public (Shenzhen ChiNext)
- Revenue
- CN¥734,977,273.05 (2025), about $102 million
Interconnect & Networking7 firms
Interconnect & NetworkingAccton Technology智邦科技
White-box switch manufacturing
A leading contract maker of white-box data center switches, building the hardware that hyperscalers run their own network software on. Accton and its peers build most 800G switch boxes.
- Customers
- Meta, Microsoft, Amazon, Google, Nvidia
- Founded
- 1988
- Ownership
- Public
- Revenue
- NT$248,319,703 thousand (2025), about $7.97 billion
Amphenol
High-speed connectors, cables and backplanes
Makes the high-speed connectors, cable assemblies and backplane systems that carry 112 Gbps signals between boards in an AI rack. The NVLink spine that links the GPUs in a rack-scale system is built from cables and connectors.
- Customers
- Nvidia, Foxconn, Quanta, Cisco, Arista
- Founded
- 1932
- Ownership
- Public
- Revenue
- $23,094.7 million (2025)
Arista Networks
Data center Ethernet switches
Builds Ethernet switches with high port counts, mostly on Broadcom's Tomahawk switch chips, that hyperscalers use for AI back-end networks as an alternative to InfiniBand.
- Customers
- Microsoft, Meta, Oracle, Anthropic
- Founded
- 2004
- Ownership
- Public
- Revenue
- $9,005.7 million (2025)
Astera Labs
PCIe and CXL retimers, fabric switches
Makes the retimers, smart cable modules and fabric switches that keep PCIe, CXL and Ethernet links intact across the distances inside an AI rack. Over those distances the signal degrades, and a retimer cleans it up and sends it on.
- Customers
- Nvidia, AMD, Amazon, Microsoft, Dell
- Founded
- 2017
- Ownership
- Public
- Revenue
- $852,525 thousand (2025)
Credo Technology
SerDes, active electrical cables and optical DSPs
Supplies high-speed SerDes IP, active electrical cables and retimers used for 400G and 800G links inside and between AI racks. Its active electrical cables are copper and carry signals up to 7 meters between neighboring racks, replacing optics over those distances at lower power.
- Customers
- Amazon, Microsoft, Nvidia, Arista
- Founded
- 2008
- Ownership
- Public
- Revenue
- $1,335,116 thousand (year to April 2026)
Cisco Systems
Networking systems and Silicon One switch chips
Sells data center switches and routers and designs its own Silicon One switch chips, giving it a second in-house alternative to switch chips bought from chip vendors for AI networks.
- Customers
- Enterprises, Cloud operators, Telecom carriers
- Founded
- 1984
- Ownership
- Public
- Revenue
- $63,325 million (year to July 2026)
Memory9 firms · 3 critical
MemoryMicron Technology
DRAM, HBM and NAND
The only American maker of leading-edge DRAM and the third HBM supplier, with fabs in the US, Japan, Taiwan and Singapore. It has CHIPS Act support for new capacity in Idaho and New York.
- Customers
- Nvidia, AMD, Intel, Dell, HPE
- Founded
- 1978
- Ownership
- Public
- Revenue
- $133,188 million (year to August 2026)
- From China
- 6.3% of revenue, year to Sep 2026
Samsung Memory삼성전자 메모리사업부
DRAM, HBM and NAND
Samsung Electronics' memory business, supplying DRAM, NAND and HBM. It began mass production of HBM4 in 2026 and says it was the first to ship commercial HBM4, at 11.7 Gbps per pin.
- Customers
- Nvidia, AMD, Google, Microsoft, Apple
- Founded
- 1983
- Ownership
- Division of Samsung Electronics (005930.KS)
- From China
- 14.2% of Samsung Electronics revenue, FY2025
SK hynix에스케이하이닉스
HBM, DRAM and NAND
The largest supplier of high bandwidth memory (HBM), with a large conventional DRAM and NAND business that includes Solidigm. HBM is a stack of DRAM chips connected by through-silicon vias, copper columns that run through the chips.
- Customers
- Nvidia, AMD, Broadcom, Microsoft, Google
- Founded
- 1983
- Ownership
- Public, part of SK Group
- Revenue
- ₩97,146,675 million (2025), about $68.3 billion
- From China
- 19.7% of revenue, FY2025
Kioxiaキオクシア株式会社
3D NAND flash
The former Toshiba Memory, making 3D NAND at Yokkaichi and Kitakami in a long-running joint venture with SanDisk. Its BiCS8 generation targets enterprise SSDs.
- Customers
- Dell, HPE, Chinese OEMs, Enterprise SSD buyers
- Founded
- 2017
- Ownership
- Public, listed in Tokyo in December 2024, with a Bain-led consortium retaining a stake
- Revenue
- ¥2,337,628 million (year to March 2026), about $15.5 billion
SanDisk
3D NAND flash and SSDs
Manufactures 3D NAND in a joint venture with Kioxia and sells client and enterprise SSDs. It became a standalone company again when Western Digital split its flash and disk businesses.
- Customers
- Dell, HPE, Hyperscale cloud operators
- Founded
- 1988
- Ownership
- Public, separated from Western Digital in 2025
- Revenue
- $20,248 million (year to June 2026)
CXMT长鑫存储
Chinese DRAM and early HBM
China's only significant DRAM maker, producing DDR4 and DDR5 and working toward HBM. It has scaled capacity quickly enough to move commodity DRAM prices.
- Customers
- Chinese OEMs, Chinese module makers, Domestic AI accelerator vendors
- Founded
- 2016
- Ownership
- Public (Shanghai STAR Market), state-backed, with the National IC Fund as an investor
- Revenue
- CN¥61,799,321,546.81 (2025), about $8.60 billion
About the revenue figure. CXMT listed in July 2026, so the figure comes from the audited accounts in its listing prospectus.
YMTC长江存储
Chinese 3D NAND
China's 3D NAND maker, using its Xtacking architecture that bonds a separately made logic wafer onto the memory array. It has been on the US Entity List since 2022.
- Customers
- Chinese SSD makers, Chinese OEMs
- Founded
- 2016
- Ownership
- State-backed, with roots in the National IC Fund and Tsinghua Unigroup
Nanya Technology南亞科技
Commodity and specialty DRAM
Taiwan's DRAM maker, producing commodity and specialty DRAM at mature nodes. It does not make HBM and is a generation or more behind the three leading DRAM makers.
- Customers
- Taiwanese module makers, Consumer electronics OEMs
- Founded
- 1995
- Ownership
- Public, part of the Formosa Plastics Group
- Revenue
- NT$66,586,520 thousand (2025), about $2.14 billion
Winbond Electronics華邦電子
Specialty DRAM, NOR flash and CUBE memory
Makes NOR flash, specialty low-power DRAM and a customized ultra-bandwidth memory called CUBE aimed at edge AI devices that cannot afford HBM.
- Customers
- Automotive suppliers, Industrial OEMs, Edge AI designers
- Founded
- 1987
- Ownership
- Public
- Revenue
- NT$89,406,171 thousand (2025), about $2.87 billion
Metrology & Inspection9 firms · 2 critical
Metrology & InspectionKLA
Wafer and reticle inspection, process control
Supplies process control equipment: optical and electron beam wafer inspection, reticle inspection, overlay and film metrology. Its tools find the defects that determine yield on large dies.
- Customers
- TSMC, Samsung, Intel, Micron, SK hynix
- Share
- 56.8% of the process control market in 2025 on CSET's count, against 11.2% for Applied Materials, the next largest. Gartner data in KLA's 2026 investor day put it at 56.5% in 2024, 6.5 times the nearest competitor.
- Founded
- 1975
- Ownership
- Public
- Revenue
- $13,579,476 thousand (year to June 2026)
- From China
- 29.8% of revenue, year to Jun 2026
Lasertecレーザーテック株式会社
EUV mask blank and pattern inspection
Makes actinic inspection tools, which use EUV light to inspect EUV mask blanks and patterned masks. Its ACTIS A150 was the world's first actinic EUV patterned mask inspection system. In October 2025 it launched the ACTIS A200HiT series, which it says triples the A150's inspection speed. These tools detect printable phase defects, flaws in a mask's reflective layers that DUV-based mask inspection cannot find.
- Customers
- TSMC, Samsung, Intel
- Founded
- 1960
- Ownership
- Public
- Revenue
- ¥230,485 million (year to June 2026), about $1.49 billion
Camtek
Advanced packaging inspection and metrology
Makes inspection and metrology systems for bumping, wafer-level packaging and HBM assembly, including tools that measure bump height and coplanarity across a wafer.
- Customers
- TSMC, ASE, Amkor, SK hynix, Micron
- Founded
- 1987
- Ownership
- Public
- Revenue
- $496,072 thousand (2025)
- From China
- 49.2% of revenue, FY2025
Hitachi High-Tech株式会社日立ハイテク
CD-SEM metrology and etch systems
The largest supplier of critical dimension scanning electron microscopes (CD-SEMs), which measure feature widths after lithography and etch. It also makes plasma etch systems and electron beam review tools.
- Customers
- TSMC, Samsung, Intel, Micron, SK hynix
- Founded
- 1947
- Ownership
- Wholly owned subsidiary of Hitachi
Nova Ltd
Optical CD and materials metrology
Supplies optical critical dimension scatterometry and X-ray metrology used to measure three-dimensional structures such as gate-all-around nanosheets and high aspect ratio memory holes.
- Customers
- TSMC, Samsung, Intel, SK hynix, Micron
- Founded
- 1993
- Ownership
- Public
- Revenue
- $880,577 thousand (2025)
- From China
- 33% of revenue, FY2025
Onto Innovation
Optical metrology, inspection and lithography software
Supplies optical film metrology, macro defect inspection and packaging inspection, with a strong position in advanced packaging metrology. It was formed from Rudolph Technologies and Nanometrics.
- Customers
- TSMC, Samsung, Micron, ASE, Amkor
- Founded
- 2019
- Ownership
- Public
- Revenue
- $1,005,263 thousand (2025)
- From China
- 7.0% of revenue, FY2025
Park Systems파크시스템스
Atomic force microscopy
Makes the automated atomic force microscopes fabs use to measure surface roughness, step height and defect profiles at sub-nanometer resolution. It acquired the ellipsometry maker Accurion in 2022 and the holographic microscopy maker Lyncée Tec in 2025.
- Customers
- Samsung, SK hynix, TSMC, Intel
- Founded
- 1997
- Ownership
- Public (KOSDAQ)
- Revenue
- ₩205,613,479,882 (2025), about $145 million
Skyverse Technology中科飞测
Domestic Chinese wafer inspection and metrology
A Shenzhen maker of wafer defect inspection and film metrology tools, aiming to replace KLA systems in Chinese fabs. Its coverage is strongest at mature nodes.
- Customers
- SMIC, Hua Hong, CXMT, YMTC
- Share
- 2,053,298,171.74 yuan of revenue in 2025, up 48.75% on 2024, per its 2025 annual report summary.
- Founded
- 2014
- Ownership
- Public (Shanghai STAR Market), with state-backed investors
Wuhan Jingce Electronic武汉精测电子
Domestic Chinese metrology and display test
Makes semiconductor film metrology, electrical test and defect inspection tools for Chinese fabs through its Wuhan Jingce Semiconductor arm. It started in flat panel display test.
- Customers
- SMIC, CXMT, YMTC, BOE
- Founded
- 2006
- Ownership
- Public (Shenzhen ChiNext)
- Revenue
- CN¥3,347,637,577 (2025), about $466 million
Foundry9 firms · 1 critical
FoundryTSMC台灣積體電路製造
Leading-edge logic foundry and advanced packaging
Manufactures almost every leading-edge AI accelerator, including those of Nvidia, AMD and Broadcom and the custom chips of large cloud companies, on its N4, N3 and N2 processes. It also owns CoWoS and SoIC advanced packaging, and its packaging capacity is a tighter constraint than its wafer capacity.
- Customers
- Nvidia, Apple, AMD, Broadcom, Qualcomm, MediaTek
- Founded
- 1987
- Ownership
- Public, with the Taiwanese state holding a minority stake
- Revenue
- NT$3,809,054,272 thousand (2025), about $122 billion
- From China
- 8.6% of revenue, FY2025
Samsung Foundry삼성 파운드리
Leading-edge logic foundry
A foundry running its 2 nm class SF2 process in Korea and building a fab in Taylor, Texas. Its gate-all-around transistors, introduced at 3 nm, are in production. Large AI customers keep qualifying it as a second source.
- Customers
- Tesla, Qualcomm, Nvidia, Rebellions, Ambarella
- Founded
- 2005
- Ownership
- Division of Samsung Electronics (005930.KS)
- From China
- 14.2% of Samsung Electronics revenue, FY2025
Tower Semiconductor
Specialty analog and silicon photonics foundry
A specialty foundry for analog, RF, power and silicon photonics, including the photonic integrated circuits used in optical transceivers and co-packaged optics.
- Customers
- Broadcom, Marvell, Coherent, Nvidia
- Founded
- 1993
- Ownership
- Public
- Revenue
- $1,566,104 thousand (2025)
Hua Hong Semiconductor华虹半导体
Mature-node specialty foundry
A foundry focused on mature-node specialty processes, including power management, embedded memory and analog. It is mainland China's second largest pure-play foundry and the world's fifth largest by 2025 sales. It does not make leading-edge logic.
- Customers
- Chinese fabless firms, Power semiconductor designers
- Founded
- 1996
- Ownership
- Public (Hong Kong and Shanghai), state-backed
- Revenue
- $2,402,064 thousand (2025)
Intel Foundry
Leading-edge logic foundry and packaging
Intel's manufacturing arm, running the 18A process with RibbonFET gate-all-around and PowerVia backside power, plus EMIB and Foveros packaging. Most of its output is still Intel's own chips. Outside customers provided only $293 million of its $5.765 billion of segment revenue in the quarter to 27 June 2026.
- Customers
- Intel, Microsoft, Amazon, US Department of Defense
- Founded
- 2021
- Ownership
- Division of Intel Corporation, in which the US government took an equity stake in 2025
Rapidusラピダス株式会社
2 nm pilot foundry
Runs a 2 nm gate-all-around pilot line in Chitose, Hokkaido, using IBM and imec technology and ASML EUV tools. It is Japan's attempt to rebuild leading-edge logic manufacturing.
- Customers
- Tenstorrent, Japanese design partners, Preferred Networks
- Founded
- 2022
- Ownership
- Private, funded by the Japanese government and a consortium of Japanese firms
SMIC中芯国际
Chinese logic foundry
China's largest foundry, producing 7 nm class logic using multipatterning on immersion DUV because it cannot buy EUV. CSET reported in June 2024 that Huawei's Ascend 910B AI chip is believed to be made on its N+2 process. But SemiAnalysis judged in April 2025 that most 910B and 910C chips were made at TSMC. It is on the US Entity List.
- Customers
- Huawei HiSilicon, Cambricon, Chinese fabless firms
- Founded
- 2000
- Ownership
- Public (Hong Kong and Shanghai), state-backed, with the National IC Fund as an investor
- Revenue
- $9,326,799 thousand (2025)
GlobalFoundries
Specialty and mature-node foundry
Runs mature and specialty processes for RF, automotive, power and silicon photonics from fabs in New York, Vermont, Germany and Singapore. It stopped developing leading-edge processes in 2018.
- Customers
- Qualcomm, NXP, Infineon, Cisco, AMD
- Founded
- 2009
- Ownership
- Public, with Mubadala of Abu Dhabi as the largest shareholder
- Revenue
- $6,791 million (2025)
UMC聯華電子
Mature-node foundry
Taiwan's second largest foundry, running processes of 28 nm and above for display drivers, power management, connectivity and automotive parts. It is expanding 12 nm capacity in partnership with Intel.
- Customers
- MediaTek, Texas Instruments, Realtek, Novatek
- Founded
- 1980
- Ownership
- Public
- Revenue
- NT$237,553,199 thousand (2025), about $7.62 billion
Optics & Photonics9 firms
Optics & PhotonicsCoherent Corp
Lasers, optical components and transceivers
Makes indium phosphide lasers, VCSELs, optical components and transceiver modules. It is one of the few module makers that also makes the laser chips inside them, including at an indium phosphide wafer fab in Sherman, Texas.
- Customers
- Nvidia, Cisco, Arista, Google, Amazon
- Founded
- 1971
- Ownership
- Public
- Revenue
- $7,118,181 thousand (year to June 2026)
Corning
Optical fiber, cable and glass substrates
Makes the optical fiber and cabling that connect data center halls and campuses, and develops glass substrates for semiconductor packaging. It also holds the majority stake in Hemlock Semiconductor.
- Customers
- Hyperscale cloud operators, Telecom carriers, AT&T
- Founded
- 1851
- Ownership
- Public
- Revenue
- $15,629 million (2025)
Eoptolink Technology新易盛
High-speed optical transceivers
A major supplier of 400G, 800G and 1.6T optical transceivers to cloud and AI data center operators, and one of the fastest growing Chinese optics firms.
- Customers
- Hyperscale cloud operators, Networking OEMs
- Founded
- 2008
- Ownership
- Public (Shenzhen ChiNext)
- Revenue
- CN¥24,841,854,840.22 (2025), about $3.46 billion
Fabrinet
Contract manufacturing of optical modules
A contract manufacturer of optical modules and photonic assemblies, building transceivers and optical engines for the largest networking and AI vendors from plants in Thailand.
- Customers
- Nvidia, Cisco, Coherent, Lumentum
- Founded
- 2000
- Ownership
- Public, incorporated in the Cayman Islands with operations in Thailand
- Revenue
- $4,641,097 thousand (year to June 2026)
Innolight Technology中际旭创
800G and 1.6T optical transceivers
A world-leading maker of high-speed optical transceiver modules for data centers, shipping 800G and 1.6T modules to hyperscalers. AI clusters need one or more optical modules per accelerator.
- Customers
- Nvidia, Google, Microsoft, Amazon, Meta
- Founded
- 2008
- Ownership
- Public (Shenzhen ChiNext)
- Revenue
- CN¥38,239,935,640.67 (2025), about $5.32 billion
Lumentum
Lasers, photonic components and transceivers
Supplies indium phosphide lasers, electro-absorption modulated lasers and optical modules for data center and telecom links, and is expanding capacity for AI cluster demand. It makes laser chips at a wafer fab in Sagamihara, Japan.
- Customers
- Cloud operators, Networking OEMs, Optical module makers
- Founded
- 2015
- Ownership
- Public
- Revenue
- $3,014.0 million (year to June 2026)
AXT
Indium phosphide and gallium arsenide substrates
Makes the indium phosphide wafers that lasers for optical links are grown on. It is listed in the US but does all its manufacturing in China. China has required export permits for indium phosphide substrates since February 2025. In its filing for the quarter to June 2026, AXT called the permits the most significant challenge it faces.
- Customers
- Laser and optical component makers
- Founded
- 1986
- Ownership
- Public
Ayar Labs
In-package optical I/O
Builds optical input and output chiplets that put light directly into the processor package, replacing electrical SerDes with fiber at the package edge.
- Customers
- Nvidia, Intel, HPE, Lockheed Martin
- Founded
- 2015
- Ownership
- Private, with investors including Nvidia, Intel Capital and AMD
Lightmatter
Photonic interconnect and compute
Develops photonic interposers and optical interconnect that route light beneath stacked dies, aiming to remove the bandwidth limit between accelerators in a package.
- Customers
- Research and hyperscale partners under development
- Founded
- 2017
- Ownership
- Private, venture-backed
Photomasks10 firms · 4 critical
PhotomasksAGC Inc.AGC株式会社
EUV and DUV mask blanks, synthetic quartz
The main supplier of EUV mask blanks besides Hoya, and a major maker of synthetic quartz substrates and photomask glass. AGC says it is the only blank maker that produces EUV blanks in-house from the glass material through the coating. Its glass expertise comes from a much larger architectural and automotive glass business.
- Customers
- TSMC, Samsung, Intel, Photronics
- Founded
- 1907
- Ownership
- Public
- Revenue
- ¥2,058,832 million (2025), about $13.8 billion
HoyaHOYA株式会社
EUV and DUV mask blanks
Makes the ultra-flat low-thermal-expansion glass blanks, coated with molybdenum-silicon multilayers, that become EUV photomasks. Hoya says it holds an exceptionally high share of the EUV mask blank market.
- Customers
- TSMC, Samsung, Intel, Toppan, Dai Nippon Printing
- Founded
- 1941
- Ownership
- Public
- Revenue
- ¥947,749 million (year to March 2026), about $6.29 billion
- From China
- 9.9% of revenue, year to Mar 2026
IMS Nanofabrication
Multi-beam mask writers
Builds the multi-beam electron mask writers that pattern EUV masks with hundreds of thousands of parallel beamlets. On CSET's count it led the market for all electron-beam mask writers in 2025. NuFlare is the only other maker of multi-beam writers.
- Customers
- TSMC, Samsung, Intel, Toppan, Dai Nippon Printing
- Share
- 46.6% of the $994M market for all electron-beam mask writers in 2025, ahead of NuFlare (39.2%) and JEOL (14.2%), on CSET's analysis of TechInsights data
- Founded
- 1985
- Ownership
- Majority owned by Intel, with Bain Capital and TSMC holding minority stakes
Mitsui Chemicals三井化学株式会社
EUV pellicles and semiconductor materials
Supplies EUV pellicles, the thin membranes that keep particles off a photomask while it is exposed. EUV pellicles must transmit over 90 percent of 13.5 nm light and survive high source power. Only a few suppliers make them.
- Customers
- TSMC, Samsung, Intel, ASML
- Founded
- 1912
- Ownership
- Public
- Revenue
- ¥1,668,754 million (year to March 2026), about $11.1 billion
Dai Nippon Printing大日本印刷株式会社
Photomasks and lead frames
Makes photomasks, including EUV masks, plus lead frames and other electronic components. Like Toppan, it applied the precision of commercial printing to semiconductor patterning.
- Customers
- TSMC, Samsung, Intel, Kioxia
- Founded
- 1876
- Ownership
- Public
- Revenue
- ¥1,512,571 million (year to March 2026), about $10.0 billion
NuFlare Technology株式会社ニューフレアテクノロジー
Electron-beam mask writers and inspection
Makes variable-shaped-beam and multi-beam electron mask writers and mask inspection systems. Its MBM series competes with IMS Nanofabrication in multi-beam mask writing.
- Customers
- Toppan, Dai Nippon Printing, Photronics, Samsung
- Founded
- 2002
- Ownership
- Subsidiary of Toshiba
Photronics
Merchant photomask manufacturing
A merchant photomask maker, writing and inspecting masks for logic and display customers from plants in the US, Taiwan, Korea, China and Europe. The foundries make most leading-edge masks in-house.
- Customers
- UMC, SMIC, Samsung, Texas Instruments
- Founded
- 1969
- Ownership
- Public
- Revenue
- $849,294 thousand (year to October 2025)
Toppan HoldingsTOPPANホールディングス
Advanced photomasks and FC-BGA substrates
Makes advanced photomasks through its photomask arm and is building flip-chip BGA substrate capacity for AI packages. Its photomask business became a separate company, Tekscend Photomask, which is listed in Tokyo.
- Customers
- TSMC, Samsung, Intel, Micron
- Founded
- 1900
- Ownership
- Public
- Revenue
- ¥1,805,033 million (year to March 2026), about $12.0 billion
Shenzhen Newway Photomask路维光电
Merchant photomasks for chips and displays
A Chinese merchant mask maker that Photronics names among its competitors in chip and display masks. No Chinese firm makes EUV mask blanks or the tools that check EUV masks.
- Customers
- Chip and display makers
- Ownership
- Public (Shanghai STAR Market)
Shenzhen Qingyi Photomask清溢光电
Merchant photomasks for chips and displays
A Chinese merchant mask maker that Photronics names among its competitors in chip and display masks. No Chinese firm makes EUV mask blanks or the tools that check EUV masks.
- Customers
- Chip and display makers
- Ownership
- Public (Shanghai STAR Market)
Test10 firms · 1 critical
TestAdvantest株式会社アドバンテスト
SoC and memory automated test equipment
Makes automated test equipment for logic and memory, including the V93000 platform used to test AI accelerators and the testers used for HBM. Test time on AI dies is long and rising.
- Customers
- TSMC, Nvidia, SK hynix, King Yuan Electronics, Samsung
- Share
- 66% of the SoC tester market in CY2025, up from 56% in CY2024, on Advantest's own tester market share report
- Founded
- 1954
- Ownership
- Public
- Revenue
- ¥1,128,610 million (year to March 2026), about $7.49 billion
- From China
- 18.9% of revenue, year to Mar 2026
Aehr Test Systems
Wafer-level burn-in and reliability test
Makes wafer-level burn-in systems, which stress an entire wafer at high temperature and voltage to find early-life failures. They are used for silicon carbide, photonics and AI processors.
- Customers
- Silicon carbide makers, AI processor vendors, Photonics suppliers
- Founded
- 1977
- Ownership
- Public
- Revenue
- $50,001 thousand (year to May 2026)
Chroma ATE致茂電子
Test instruments, handlers and system-level test
Makes automated test equipment, power test instruments and system-level test (SLT) platforms, including the burn-in and SLT systems used for AI processors and power components.
- Customers
- TSMC, ASE, King Yuan Electronics, Nvidia suppliers
- Founded
- 1984
- Ownership
- Public
- Revenue
- NT$28,310,935 thousand (2025), about $908 million
Cohu
Test handlers, contactors and interface
Makes the handlers that move devices in and out of testers, along with thermal subsystems, contactors and interface boards. For AI chips that run hot, handling and thermal control are as important as the tester itself.
- Customers
- Amkor, ASE, Analog Devices, NXP
- Founded
- 1947
- Ownership
- Public
- Revenue
- $452,956 thousand (2025)
FormFactor
Probe cards and test systems
Supplies the MEMS probe cards that make temporary electrical contact with thousands of pads on a wafer during testing, including HBM and logic probe cards. It is a leading probe card maker, with $637.9 million of revenue in its probe card segment in 2025.
- Customers
- Nvidia, SK hynix, Micron, Intel, TSMC
- Founded
- 1993
- Ownership
- Public
- Revenue
- $784,993 thousand (2025)
Micronics Japan株式会社日本マイクロニクス
Probe cards for memory test
Makes probe cards specialized for memory wafer test, including cards that test many DRAM and HBM dies in parallel, plus display test equipment.
- Customers
- SK hynix, Micron, Samsung, Kioxia
- Founded
- 1970
- Ownership
- Public
- Revenue
- ¥70,173 million (2025), about $469 million
MPI Corporation旺矽科技
Probe cards and probe stations
Supplies vertical probe cards, engineering probe stations and thermal test systems, serving Taiwanese foundry and OSAT test operations.
- Customers
- TSMC, King Yuan Electronics, ASE, Chinese fabs
- Founded
- 1995
- Ownership
- Public
- Revenue
- NT$13,371,181 thousand (2025), about $429 million
Technoprobe
Probe cards and probe heads
Makes probe cards, specializing in vertical MEMS probe heads used for high pin count logic and HBM test. It is the main European probe card maker and the closest competitor to FormFactor.
- Customers
- Nvidia, Apple, Intel, TSMC, SK hynix
- Founded
- 1996
- Ownership
- Public, family-controlled
- Revenue
- €628,380 thousand (2025), about $710 million
Teradyne
Automated test equipment
Supplies SoC, memory and system-level test platforms, and forms the automated test equipment duopoly with Advantest. It also sells industrial automation equipment through its robotics arm.
- Customers
- Apple, Qualcomm, Nvidia, Analog Devices, Amkor
- Share
- $2.52bn of semiconductor test revenue in 2025, service included: $1.89bn from SoC testers and $0.505bn from memory testers, per its 2025 10-K
- Founded
- 1960
- Ownership
- Public
- Revenue
- $3,190,024 thousand (2025)
- From China
- 14.1% of revenue, FY2025
Tokyo Seimitsu (Accretech)株式会社東京精密
Wafer probers, dicing machines and grinders
Makes probers, the machines that move each wafer under the probe card and hold it at a set temperature during wafer test, plus dicing machines and grinders. It sells as Accretech and says it has the top global share in probers.
- Customers
- Chipmakers, Assembly and test firms
- Share
- 8.1% of the $1.9bn market for dicing saws and wafer grinders in 2025, second to Disco, on CSET's analysis of TechInsights data
- Founded
- 1949
- Ownership
- Public
Chemicals & Gases11 firms · 2 critical
Chemicals & GasesMorita Chemical Industries森田化学工業
High-purity hydrogen fluoride and fluorine compounds
A Japanese maker of hydrofluoric acid and fluorine compounds. Its electronics grades are used to etch silicon oxide film and to clean semiconductor material.
- Customers
- Samsung, SK hynix, Chinese fabs
- Founded
- 1917
- Ownership
- Private
Stella Chemifaステラケミファ
Ultra-high-purity hydrofluoric acid
Refines hydrofluoric acid to the purity needed to etch and clean silicon without leaving metal contamination. Japan's 2019 decision to require export licenses for high-purity HF sent to Korea showed how few qualified sources exist.
- Customers
- Samsung, SK hynix, TSMC, Kioxia
- Founded
- 1916
- Ownership
- Public
- Revenue
- ¥36,799 million (year to March 2026), about $244 million
Air Liquide
Electronic specialty gases and advanced precursors
Supplies ultra-pure bulk gases, specialty etch and deposition gases and ALD precursors, with on-site plants at most leading-edge fabs. It also supplies the fluorinated gases used in plasma etch.
- Customers
- TSMC, Samsung, Intel, GlobalFoundries
- Founded
- 1902
- Ownership
- Public
- Revenue
- €26,940.2 million (group revenue, 2025), about $30.4 billion
Air Products
Bulk gases and on-site supply
Supplies bulk nitrogen, oxygen, hydrogen and helium to fabs through on-site generation, and specialty gases for etch and deposition. It is one of three global suppliers with the scale to serve a gigafab.
- Customers
- Samsung, Intel, Micron, TSMC
- Founded
- 1940
- Ownership
- Public
- Revenue
- $12,037.3 million (year to September 2025)
Entegris
Filtration, wafer handling and process chemistries
Makes the filters, purifiers, fluid handling components, wafer carriers and specialty coatings that keep contamination out of a fab. It also sells CMP slurries, a business it gained by buying CMC Materials. Fabs use up its products continuously.
- Customers
- TSMC, Samsung, Intel, Micron, SK hynix
- Founded
- 1966
- Ownership
- Public
- Revenue
- $3,196.6 million (2025)
- From China
- 20.6% of revenue, FY2025
Kanto Denka Kogyo関東電化工業
Fluorinated etch gases
Makes fluorine-based specialty gases including tungsten hexafluoride and carbon fluorides used for plasma etch and chamber cleaning. It is one of a small number of qualified sources for several of these molecules.
- Customers
- Samsung, SK hynix, Micron, Kioxia
- Founded
- 1938
- Ownership
- Public
- Revenue
- ¥65,400 million (year to March 2026), about $434 million
Linde
Bulk and electronic specialty gases
The world's largest industrial gas company. It supplies fabs with nitrogen, hydrogen, helium and rare gases such as the neon used in excimer lasers, usually from plants built next to the fab. Gas supply contracts run for a decade or more.
- Customers
- TSMC, Samsung, Intel, Micron, SK hynix
- Share
- Counted under Germany in the specialty gases country share, a judgment call based on its operating history
- Founded
- 1879
- Ownership
- Public. Linde plc, whose predecessor companies Praxair and Linde AG merged in 2018, is incorporated in Ireland, with principal offices in the UK and the US
- Revenue
- $33,986 million (group revenue, 2025)
Merck KGaA
Electronic materials, deposition gases and specialty chemicals
Its electronics division supplies deposition precursors, specialty gases, CMP slurries and dielectrics. Merck built the division around its acquisitions of Versum Materials and AZ Electronic Materials. It sells one of the broadest ranges of materials of any single supplier.
- Customers
- TSMC, Samsung, Intel, Micron, SK hynix
- Founded
- 1668
- Ownership
- Public, family-controlled
- Revenue
- €21,102 million (group revenue, 2025), about $23.8 billion
Nippon Sanso Holdings日本酸素ホールディングス
Electronic specialty and bulk gases
The parent of Taiyo Nippon Sanso, supplying bulk and electronic specialty gases in Japan, the US and Asia. It is a major source of the high-purity gases Japanese and Taiwanese fabs consume.
- Customers
- TSMC, Kioxia, Micron, Samsung
- Founded
- 1910
- Ownership
- Public
- Revenue
- ¥1,359,611 million (year to March 2026), about $9.02 billion
Resonac Holdings株式会社レゾナック
Etch gases, packaging materials and CMP slurries
Supplies high-purity etch gases, CMP slurries, die attach films, and the copper-clad laminates and encapsulants used in advanced packaging. It was formed from Showa Denko and Hitachi Chemical. It leads a consortium on panel-level packaging.
- Customers
- TSMC, Samsung, ASE, Amkor, Intel
- Founded
- 1939
- Ownership
- Public
- Revenue
- ¥1,347,125 million (2025), about $9.00 billion
SK Specialty에스케이스페셜티
Nitrogen trifluoride and specialty etch gases
Produces nitrogen trifluoride, the gas used to clean deposition chambers, plus tungsten hexafluoride and other specialty etch gases. The more wafers a fab runs through deposition, the more chamber cleaning gas it uses.
- Customers
- Samsung, SK hynix, TSMC
- Founded
- 1998
- Ownership
- Formerly SK Materials, and SK Inc. sold a majority stake to Hahn & Company
Deposition & Etch11 firms · 1 critical
Deposition & EtchTokyo Electron東京エレクトロン株式会社
Coater/developer track, etch, deposition and clean
Makes the coater/developer track, which applies photoresist, develops it after exposure and is physically linked to every scanner in a fab. It also makes etch, deposition, cleaning and wafer bonding systems, and wafer probers for chip testing.
- Customers
- TSMC, Samsung, Intel, SK hynix, Micron
- Share
- 91% of the world coater/developer (track) market in CY2025, on Gartner data published in Tokyo Electron's own results presentation
- Founded
- 1963
- Ownership
- Public
- Revenue
- ¥2,443,533 million (year to March 2026), about $16.2 billion
- From China
- 34.1% of revenue, year to Mar 2026
Applied Materials
Deposition, epitaxy, CMP, implant and e-beam metrology
Makes tools for physical and chemical vapor deposition, epitaxy, ion implantation, chemical mechanical planarization and electron beam inspection. Its tools cover more process steps than any other vendor's.
- Customers
- TSMC, Samsung, Intel, Micron, SK hynix
- Founded
- 1967
- Ownership
- Public
- Revenue
- $28,368 million (year to October 2025)
- From China
- 30.1% of revenue, year to Oct 2025
ASM International
Atomic layer deposition and epitaxy
Makes atomic layer deposition (ALD) tools, which grow films one atomic layer at a time. Chipmakers use ALD to build gate-all-around transistors and high-k dielectrics. ASM also makes epitaxy and plasma-enhanced ALD tools.
- Customers
- TSMC, Samsung, Intel, Micron
- Founded
- 1968
- Ownership
- Public
- Revenue
- €3,173.2 million (2025), about $3.59 billion
Kokusai Electric株式会社Kokusai Electric
Batch ALD and vertical furnaces
Makes batch vertical furnaces and batch ALD systems that process dozens of wafers at once. Memory makers use them widely for DRAM and 3D NAND film steps where throughput matters more than single-wafer control.
- Customers
- Samsung, SK hynix, Micron, Kioxia, TSMC
- Founded
- 2018
- Ownership
- Public, listed in Tokyo in 2023 after KKR ownership
- Revenue
- ¥235,079 million (year to March 2026), about $1.56 billion
Lam Research
Plasma etch, deposition and wafer clean
The largest supplier of plasma etch systems. According to CSET, it had 41.1 percent of the $21.9 billion dry etch tool market in 2025, against 23.4 percent for Tokyo Electron. Its line includes the high aspect ratio etch used to drill 3D NAND channels and DRAM capacitors, plus atomic layer deposition, electroplating and cryogenic etch tools.
- Customers
- Samsung, SK hynix, Micron, TSMC, Kioxia
- Founded
- 1980
- Ownership
- Public
- Revenue
- $23,232,690 thousand (year to June 2026)
- From China
- 33.8% of revenue, year to Jun 2026
SCREEN Holdings株式会社SCREENホールディングス
Wafer cleaning and surface preparation
Makes the single-wafer and batch cleaning systems that remove particles and residues between almost every process step. Cleaning is the most frequently repeated operation in a fab.
- Customers
- TSMC, Samsung, Intel, Micron, SK hynix
- Founded
- 1868
- Ownership
- Public
- Revenue
- ¥605,748 million (year to March 2026), about $4.02 billion
- From China
- 38.4% of revenue, year to Mar 2026
SEMES세메스
Cleaning, track and packaging equipment
Supplies wafer cleaning, coater/developer track, etch and packaging systems, mainly to Samsung. By its own description it is Korea's largest maker of chip and display equipment, with sales of about KRW 2.46 trillion in 2025. Through SEMES, Samsung keeps some tool technology in house.
- Customers
- Samsung, SK hynix
- Founded
- 1993
- Ownership
- Majority owned by Samsung Electronics
ACM Research盛美半导体
Wafer cleaning, plating and packaging tools
Makes single-wafer cleaning systems using megasonic and bubble technologies, plus electroplating and advanced packaging tools. It is US-listed but manufactures and sells largely in China.
- Customers
- SMIC, Hua Hong, YMTC, CXMT, SK hynix
- Founded
- 1998
- Ownership
- Public, with principal operations through ACM Research Shanghai
- Revenue
- $901,309 thousand (2025)
AMEC中微公司
Plasma etch and MOCVD
Advanced Micro-Fabrication Equipment makes capacitively and inductively coupled plasma etch systems used at Chinese logic and memory fabs, plus MOCVD reactors for LEDs. Its etchers are the most competitive Chinese tools at advanced nodes.
- Customers
- SMIC, Hua Hong, CXMT, TSMC
- Founded
- 2004
- Ownership
- Public (Shanghai STAR Market)
- Revenue
- CN¥12,384,638,268.11 (2025), about $1.72 billion
Naura Technology北方华创
Etch, deposition, clean and furnace systems
China's largest semiconductor equipment maker, with plasma etch, deposition (PVD, CVD and ALD), furnace and cleaning tools. As Chinese fabs replaced foreign tools with local ones, Naura rose into the world's top ten chipmaking equipment suppliers by sales in 2025. That year three Chinese firms made the global top 20, up from one in 2022.
- Customers
- SMIC, Hua Hong, CXMT, YMTC
- Founded
- 2001
- Ownership
- Public (Shenzhen), state-backed, with the National IC Fund as an investor
- Revenue
- CN¥39,353,112,419.78 (2025), about $5.48 billion
Piotech拓荆科技
PECVD, ALD and wafer bonding
China's main domestic supplier of plasma-enhanced CVD and ALD systems, and more recently hybrid wafer bonding tools aimed at 3D integration.
- Customers
- SMIC, CXMT, YMTC, Hua Hong
- Founded
- 2010
- Ownership
- Public (Shanghai STAR Market), state-backed
- Revenue
- CN¥6,519,094,874.63 (2025), about $907 million
Photoresist & Materials11 firms
Photoresist & MaterialsAdeka株式会社ADEKA
ALD and CVD precursor chemicals
Makes the organometallic precursor molecules that atomic layer deposition tools use to build films one atomic layer at a time, including metal films and the high-k insulating layers in transistor gates.
- Customers
- Samsung, SK hynix, TSMC, Micron
- Founded
- 1917
- Ownership
- Public
- Revenue
- ¥416,563 million (year to March 2026), about $2.76 billion
Fujifilm富士フイルム
Photoresist, CMP slurry and cleaning chemicals
Makes photoresist, developers, CMP polishing slurries, polyimides and cleaning chemicals. It built this large electronic materials business from its photographic film chemistry. Electronic materials are a minority of group revenue but a major share of world supply.
- Customers
- TSMC, Samsung, Intel, Micron
- Founded
- 1934
- Ownership
- Public
- Revenue
- ¥3,356,969 million (year to March 2026), about $22.3 billion
Fujimi Incorporated株式会社フジミインコーポレーテッド
CMP slurries and polishing materials
Makes the abrasive slurries used to polish silicon wafers and to planarize (polish flat) the metal and insulating layers built up during chip fabrication. Fujimi tunes each slurry for the process step and the customer.
- Customers
- TSMC, Samsung, SUMCO, Shin-Etsu Chemical
- Founded
- 1950
- Ownership
- Public
- Revenue
- ¥69,404 million (year to March 2026), about $460 million
Inpria
Metal-oxide EUV photoresist
Developed tin-oxide EUV resists that absorb EUV photons far more efficiently than organic chemically amplified resists. Higher absorption cuts the light dose needed and sharpens resolution on High-NA EUV tools.
- Customers
- Intel, TSMC, Samsung, imec
- Founded
- 2007
- Ownership
- Subsidiary of JSR Corporation
JSR CorporationJSR株式会社
ArF, KrF and EUV photoresist
A Japanese maker of photoresist, the light-sensitive coating that chip patterns are printed into. It owns Inpria, an Oregon maker of metal-oxide resist for extreme ultraviolet (EUV) printing. A company controlled by the Japan Investment Corporation bought 84.36 percent of its shares in a tender offer that closed on 16 April 2024. Its shares were delisted from the Tokyo Stock Exchange on 25 June 2024.
- Customers
- TSMC, Samsung, Intel, SK hynix
- Founded
- 1957
- Ownership
- Taken private by the Japan Investment Corporation in 2024
JX Advanced MetalsJX金属
Sputtering targets and ultra-high-purity metals
Supplies the ultra-high-purity copper, tantalum and titanium sputtering targets used to deposit the metal interconnect on a chip, along with high-purity treated rolled copper foil for substrates.
- Customers
- TSMC, Samsung, Intel, Micron
- Founded
- 1905
- Ownership
- Public, listed in Tokyo in 2025 after being spun out of ENEOS
- Revenue
- ¥884,638 million (year to March 2026), about $5.87 billion
Qnity Electronics
CMP slurries and pads, lithography and packaging materials
DuPont's former electronics business, an independent company since 1 November 2025. It supplies chemical mechanical planarization slurries and pads, lithographic materials, and metallization and other materials for chip packaging and circuit boards.
- Customers
- TSMC, Samsung, Intel, Micron, ASE
- Founded
- 2025
- Ownership
- Public, separated from DuPont on 1 November 2025
- Revenue
- $4,754 million (2025)
Sumitomo Chemical住友化学
Photoresist and high-purity aluminum targets
Makes ArF and EUV photoresist and high-purity metals and compounds for fabs, though its petrochemical and agrochemical business is much larger. It is one of the four or five firms with EUV resist that chipmakers have qualified for production.
- Customers
- TSMC, Samsung, Intel
- Founded
- 1913
- Ownership
- Public
- Revenue
- ¥2,328,515 million (year to March 2026), about $15.4 billion
Tokyo Ohka Kogyo東京応化工業
Photoresist and high-purity process chemicals
Makes photoresist for KrF, ArF immersion and EUV lithography, plus developers, strippers and thick-film resists used in advanced packaging. It has supplied resist since the industry's early days.
- Customers
- TSMC, Samsung, Intel, Micron, Kioxia
- Founded
- 1936
- Ownership
- Public
- Revenue
- ¥237,029 million (2025), about $1.58 billion
Dongjin Semichem동진쎄미켐
Photoresist and thinner for Korean fabs
Korea's main domestic photoresist maker, covering i-line, KrF and ArF grades with EUV under development. It expanded after Japan restricted exports of key materials to Korea in 2019.
- Customers
- Samsung, SK hynix
- Founded
- 1967
- Ownership
- Public (KOSDAQ)
Soulbrain솔브레인
High-purity etchants and electrolytes
Supplies high-purity hydrogen fluoride (HF) etchant, CVD precursors and cleaning chemicals to Korean memory fabs. It localized HF production after the 2019 Japanese export restrictions.
- Customers
- Samsung, SK hynix
- Founded
- 1986
- Ownership
- Public (KOSDAQ)
- Revenue
- ₩923,381,966,875 (2025), about $649 million
Silicon & Wafers12 firms
Silicon & WafersGlobalWafers環球晶圓
Silicon wafers, SOI and compound substrates
The third-largest wafer maker, with fabs in Taiwan, Japan, the US and Europe. It built a new 300 mm plant in Sherman, Texas, with CHIPS Act support. In its annual report for 2025 it ranked itself third and put its shipments at about 15 to 20 percent of global semiconductor wafer output. It also supplies silicon-on-insulator (SOI) and compound semiconductor substrates.
- Customers
- TSMC, Texas Instruments, Infineon, Micron
- Founded
- 2011
- Ownership
- Public, controlled by Sino-American Silicon Products
- Revenue
- NT$60,597,938 thousand (2025), about $1.94 billion
Hemlock Semiconductor
Ultra-high-purity polysilicon feedstock
Makes the ultra-pure polysilicon that is melted to grow the crystal ingots wafers are cut from. Only a few plants worldwide make semiconductor-grade material. Siltronic names Hemlock among the five major suppliers of electronic-grade silicon in 2025.
- Customers
- Shin-Etsu Chemical, SUMCO, GlobalWafers, Siltronic
- Founded
- 1961
- Ownership
- Private, majority owned by Corning with Japanese partners
Shin-Etsu Chemical信越化学工業
300 mm polished and epitaxial wafers, photoresist, pellicles
The world's largest silicon wafer maker by capacity and shipments. Silicon wafers are the blank discs every logic and memory die is built on. Shin-Etsu held an estimated 22 percent of global 300 mm wafer capacity at the end of 2024, according to the October 2025 listing prospectus of the Chinese wafer maker Eswin. It also makes ArF and EUV photoresist, the light-sensitive coating chip patterns are printed into, and pellicles, the thin films that keep dust off photomasks. So it supplies three separate stages of the chain.
- Customers
- TSMC, Samsung, Intel, Micron, SK hynix
- Founded
- 1926
- Ownership
- Public
- Revenue
- ¥2,573,969 million (year to March 2026), about $17.1 billion
Siltronic
300 mm polished and epitaxial wafers
Europe's silicon wafer maker, with 300 mm capacity in Germany and a newer fab in Singapore. Its planned sale to GlobalWafers lapsed in 2022 when the German government did not grant investment clearance before the deadline.
- Customers
- Infineon, STMicroelectronics, Intel, Micron
- Founded
- 1968
- Ownership
- Public, with Wacker Chemie holding a large minority stake
- Revenue
- €1,346.7 million (2025), about $1.52 billion
SK Siltron에스케이실트론
300 mm silicon wafers and SiC substrates
Korea's silicon wafer maker, supplying 300 mm wafers largely to Samsung and SK hynix. It also makes silicon carbide substrates for power devices at a US plant in Michigan.
- Customers
- SK hynix, Samsung, Micron
- Founded
- 1983
- Ownership
- Part of SK Group, which agreed in July 2026 to sell a 70.6 percent stake to Doosan
Soitec
Engineered substrates, SOI and POI
Makes engineered substrates with its Smart Cut process, which moves a thin crystal layer from one wafer onto another. Most are silicon-on-insulator for radio-frequency (RF) and automotive chips, or piezoelectric-on-insulator for radio filters.
- Customers
- GlobalFoundries, STMicroelectronics, Qorvo, Samsung
- Founded
- 1992
- Ownership
- Public
- Revenue
- €592,319 thousand (year to March 2026), about $687 million
SUMCO株式会社SUMCO
300 mm polished and epitaxial wafers
The second-largest silicon wafer maker by capacity and shipments. It makes only wafers, selling polished and epitaxial 300 mm wafers to logic and memory fabs worldwide. It held an estimated 20 percent of global 300 mm wafer capacity at the end of 2024, according to Eswin's October 2025 listing prospectus. New capacity takes three to four years to add, and customers contract for it years ahead.
- Customers
- TSMC, Samsung, SK hynix, Micron, Kioxia
- Founded
- 1999
- Ownership
- Public
- Revenue
- ¥409,670 million (2025), about $2.74 billion
Tokuyama株式会社トクヤマ
Semiconductor-grade polysilicon and IPA
Japanese chemical maker supplying semiconductor-grade polysilicon from Shunan and Malaysia, plus high-purity isopropyl alcohol and other fab chemicals. It is one of the five major suppliers of electronic-grade silicon that Siltronic names for 2025.
- Customers
- Shin-Etsu Chemical, SUMCO, TSMC
- Founded
- 1918
- Ownership
- Public
- Revenue
- ¥349,476 million (year to March 2026), about $2.32 billion
Wacker Chemie
Semiconductor-grade polysilicon
One of the few producers of semiconductor-grade polysilicon, which it makes at Burghausen in Germany and in Tennessee. Its silicone and chemicals businesses bring in much more revenue than its electronic-grade polysilicon.
- Customers
- Siltronic, SUMCO, GlobalWafers
- Founded
- 1914
- Ownership
- Public
- Revenue
- €5,485.3 million (group revenue, 2025), about $6.20 billion
Eswin Material西安奕材
300 mm polished and epitaxial wafers
Mainland China's largest maker of 300 mm wafers. It says it ranked sixth in the world with about 7.7 percent of global 300 mm shipments in the first half of 2026, up from about 6 percent in 2024.
- Customers
- Chinese chipmakers
- Ownership
- Public (Shanghai STAR Market)
National Silicon Industry Group沪硅产业
300 mm wafers for Chinese fabs
China's state-backed silicon wafer group, which owns Shanghai Zing Semiconductor (300 mm wafers) and Okmetic in Finland (specialty wafers). It is China's domestic alternative to Japanese wafer supply.
- Customers
- SMIC, Hua Hong, CXMT, YMTC
- Founded
- 2015
- Ownership
- Public (Shanghai STAR Market) and state-backed, with the National IC Fund as an investor
- Revenue
- CN¥3,716,030,112.23 (2025), about $517 million
OCI Holdings오씨아이홀딩스
Polysilicon and electronic-grade chemicals
A Korean chemical group that makes polysilicon and fab chemicals, including high-purity hydrogen peroxide and phosphoric acid. Most of its polysilicon goes to solar customers.
- Customers
- Samsung, SK hynix, Korean fabs
- Founded
- 1959
- Ownership
- Public
- Revenue
- ₩3,380,060,390 thousand (2025), about $2.38 billion
Systems & Servers12 firms
Systems & ServersCelestica
Hyperscale hardware and switch manufacturing
Builds servers, storage and 800G Ethernet switches for hyperscalers on a contract basis, and has grown strongly with AI networking demand.
- Customers
- Hyperscale cloud operators, Networking OEMs
- Founded
- 1994
- Ownership
- Public
- Revenue
- $12,390.9 million (2025)
Hon Hai Precision鴻海精密工業
AI server and rack integration
Builds Nvidia servers and rack-scale systems, with assembly in Taiwan, Mexico, the US and Southeast Asia. It is the largest electronics contract manufacturer and the world's largest AI server provider.
- Customers
- Nvidia, Microsoft, Amazon, Meta, Apple
- Founded
- 1974
- Ownership
- Public, trades as Foxconn
- Revenue
- NT$8,103,104,763 thousand (2025), about $260 billion
Inventec英業達
AI server ODM
Builds AI and general purpose servers for cloud operators and OEMs, with manufacturing in Taiwan, Mexico, the Czech Republic and Malaysia.
- Customers
- Hyperscale cloud operators, HPE, Dell
- Founded
- 1975
- Ownership
- Public
- Revenue
- NT$691,190,326 thousand (2025), about $22.2 billion
Quanta Computer廣達電腦
AI server ODM
Builds GPU baseboards, servers and full racks for hyperscalers and for Nvidia reference systems, with plants in Taiwan, the US, Mexico and Thailand. It is one of the largest AI server ODMs, the contract firms that design and build servers for other companies.
- Customers
- Google, Meta, Amazon, Nvidia, Microsoft
- Founded
- 1988
- Ownership
- Public
- Revenue
- NT$2,123,689,447 thousand (2025), about $68.1 billion
Super Micro Computer
AI servers and liquid-cooled racks
Designs and builds AI servers and complete liquid-cooled racks, with final assembly in California, Taiwan and Malaysia. It was among the first to ship direct-to-chip liquid cooling at volume.
- Customers
- CoreWeave, xAI, Enterprises, Cloud operators
- Founded
- 1993
- Ownership
- Public
- Revenue
- $39,063,072 thousand (year to June 2026)
Wistron緯創資通
AI server and GPU baseboard manufacturing
Builds GPU baseboards and AI servers, and grew quickly during the 2025 AI build-out. It also supplies liquid cooling loops and rack integration.
- Customers
- Nvidia, Microsoft, Meta, Amazon
- Founded
- 2001
- Ownership
- Public, parent of Wiwynn
- Revenue
- NT$2,186,522,636 thousand (2025), about $70.1 billion
Wiwynn緯穎科技
Hyperscale server and rack ODM
Designs and builds hyperscale servers, storage and rack systems to Open Compute designs for cloud operators, including liquid-cooled AI racks.
- Customers
- Meta, Microsoft, Amazon
- Founded
- 2012
- Ownership
- Public, majority owned by Wistron
- Revenue
- NT$950,663,310 thousand (2025), about $30.5 billion
ZT Systems
Rack-scale AI system design
Designs and validates rack-scale AI systems for hyperscalers. AMD bought it for its systems engineering team, so that AMD could ship complete racks.
- Customers
- AMD, Hyperscale cloud operators
- Founded
- 1994
- Ownership
- Acquired by AMD in 2025, and AMD sold the manufacturing operation on to Sanmina
Dell Technologies
AI servers and integrated systems
Sells PowerEdge AI servers and integrated rack systems to enterprises and AI cloud operators, adding services, financing and deployment on top of the hardware.
- Customers
- xAI, CoreWeave, Enterprises, Government
- Founded
- 1984
- Ownership
- Public
- Revenue
- $113,538 million (year to January 2026)
Hewlett Packard Enterprise
AI servers, supercomputers and networking
Builds AI servers and Cray supercomputers with direct liquid cooling, and since acquiring Juniper Networks also supplies data center networking.
- Customers
- US Department of Energy, Enterprises, Cloud operators
- Founded
- 2015
- Ownership
- Public
- Revenue
- $34,296 million (year to October 2025)
Jabil
Contract manufacturing and liquid cooling hardware
A large contract manufacturer building AI data center hardware including server racks, power distribution and liquid cooling components such as cold plates and manifolds.
- Customers
- Cloud operators, Networking OEMs, Nvidia partners
- Founded
- 1966
- Ownership
- Public
- Revenue
- $29,802 million (year to August 2025)
Lenovo联想集团
AI servers and liquid cooling
Builds AI servers and its Neptune warm-water liquid cooling systems, selling into enterprises and research computing worldwide from plants in China, Hungary, Mexico and the US.
- Customers
- Enterprises, Research institutions, Cloud operators
- Founded
- 1984
- Ownership
- Public (Hong Kong)
- Revenue
- $83,074,555 thousand (year to March 2026)
Power & Cooling13 firms
Power & CoolingCoolIT Systems
Direct liquid cooling
Makes direct-to-chip liquid cooling cold plates, coolant distribution units and manifolds for servers, and is one of the specialists the server ODMs buy from.
- Customers
- Supermicro, Dell, HPE, Cloud operators
- Founded
- 2001
- Ownership
- Subsidiary of Ecolab since July 2026
Delta Electronics台達電子
Power supplies, power shelves and thermal systems
A global leader in switching power supplies and a maker of the power shelves and busbars used in AI racks, plus fans, cold plates and coolant distribution units. It supplies equipment for the 800-volt DC power architecture that Nvidia has moved toward.
- Customers
- Nvidia, Foxconn, Quanta, Microsoft, Amazon
- Founded
- 1971
- Ownership
- Public
- Revenue
- NT$554,885,168 thousand (2025), about $17.8 billion
Eaton
Power distribution, switchgear and UPS
Makes switchgear, busway, transformers, UPS systems and power distribution units for data centers, a segment that has become supply constrained as AI campuses scale.
- Customers
- Hyperscale operators, Colocation providers, Utilities
- Founded
- 1911
- Ownership
- Public
- Revenue
- $27,448 million (group revenue, 2025)
GE Vernova
Gas turbines, grid equipment including transformers, and generation
Builds gas turbines, grid equipment and wind turbines. It is a main supplier of the new generating capacity being contracted specifically to power AI data centers. It bought the remaining half of the transformer maker Prolec GE in the first half of 2026.
- Customers
- Utilities, Hyperscale operators, Independent power producers
- Founded
- 2024
- Ownership
- Public
- Revenue
- $38,068 million (2025)
Hitachi Energy
Grid equipment and large transformers
Makes the high voltage transformers, switchgear and grid connection equipment that data center campuses need to draw hundreds of megawatts. Transformer lead times run to several years.
- Customers
- Utilities, Hyperscale operators, Grid operators
- Founded
- 2020
- Ownership
- Subsidiary of Hitachi (formerly ABB Power Grids)
Infineon
Power semiconductors and power stages
Supplies the MOSFETs, gallium nitride devices and power stages used from the grid connection through the rack power shelf to the point-of-load regulator. It is the largest power semiconductor maker, according to Omdia figures Infineon published in August 2026. Those figures give it 17.3 percent of the $32.5 billion market for power discretes and modules in 2025, against 7.2 percent for onsemi.
- Customers
- Nvidia, Delta Electronics, Vertiv, Server ODMs
- Founded
- 1999
- Ownership
- Public
- Revenue
- €14,662 million (group revenue, year to September 2025), about $16.2 billion
Mitsubishi Power
Gas turbines and power generation equipment
Makes gas turbines from the 30 MW class to the 563 MW class. It is the power systems brand of Mitsubishi Heavy Industries. In its 2025 annual report, GE Vernova names Mitsubishi Power and Siemens Energy among the key competitors of its power generation business.
- Customers
- Utilities, Independent power producers
- Ownership
- Brand of Mitsubishi Heavy Industries
Monolithic Power Systems
Point-of-load power management ICs
Makes the multiphase voltage regulator and power module chips that convert 12 or 48 volts down to the sub-one-volt rails an accelerator core needs, at currents above 1,000 amperes.
- Customers
- Nvidia, AMD, Cloud operators, Server ODMs
- Founded
- 1997
- Ownership
- Public
- Revenue
- $2,790,459 thousand (2025)
Nidecニデック株式会社
Fans, pumps and thermal modules
Makes precision motors, high static pressure server fans, pumps and liquid cooling modules, and supplies the coolant distribution hardware used in dense AI racks.
- Customers
- Server ODMs, Nvidia partners, Cloud operators
- Founded
- 1973
- Ownership
- Public
- Revenue
- ¥2,708,705 million (year to March 2026), about $18.0 billion
About the revenue figure. Nidec's auditor gave no opinion on these accounts, a disclaimer of opinion in the report filed on 30 September 2026.
Schneider Electric
Electrical distribution, UPS and cooling
Supplies medium and low voltage electrical distribution, uninterruptible power supplies under the APC brand, busway and liquid cooling for data centers, plus the design software operators plan with.
- Customers
- Microsoft, Amazon, Digital Realty, Equinix
- Founded
- 1836
- Ownership
- Public
- Revenue
- €40,152 million (group revenue, 2025), about $45.4 billion
Siemens Energy
Turbines, grid technology and transformers
Supplies gas turbines, grid transmission equipment and transformers. Its orders are booked years ahead because data center and electrification demand exceeds its manufacturing capacity.
- Customers
- Utilities, Independent power producers, Hyperscale operators
- Founded
- 2020
- Ownership
- Public
- Revenue
- €39,077 million (group revenue, year to September 2025), about $43.2 billion
Vertiv
Data center power and thermal management
Makes uninterruptible power supplies, busway power distribution, coolant distribution units and liquid cooling systems for data centers. It co-develops reference power and cooling designs with Nvidia.
- Customers
- Nvidia, Microsoft, Oracle, CoreWeave, Digital Realty
- Founded
- 1946
- Ownership
- Public
- Revenue
- $10,229.9 million (2025)
Asetek
Liquid cooling systems
Developed direct-to-chip liquid cooling for servers and high performance computing, licensing and supplying pumps, cold plates and rack coolant distribution units.
- Customers
- HPC integrators, Server OEMs
- Founded
- 2000
- Ownership
- Public (Oslo)
- Revenue
- $41,497 thousand (2025)
Equipment Subsystems & Components14 firms · 3 critical
Equipment Subsystems & ComponentsCarl Zeiss SMT
EUV projection optics, illuminators and mask metrology
Makes the multilayer mirrors and projection optics inside every EUV scanner, polished to atomic-scale flatness, plus the larger anamorphic optics for High-NA EUV scanners. Zeiss SMT exclusively supplies the optics for ASML's EUV scanners. It also makes AIMS EUV, which checks how a mask will print under the scanner's own imaging conditions, and MeRiT systems that repair masks.
- Customers
- ASML
- Founded
- 1846
- Ownership
- Part of the Zeiss Group, with ASML holding a minority stake in Carl Zeiss SMT
Trumpf
CO2 drive lasers for EUV sources
Builds the multi-kilowatt CO2 laser amplifier chain that vaporizes tin droplets to create EUV light. Trumpf describes the laser system as internationally unique.
- Customers
- ASML, Carl Zeiss SMT
- Founded
- 1923
- Ownership
- Private, family-owned
VAT Group
High-vacuum valves
Makes the high-vacuum isolation and control valves that seal and gate every process chamber. How many particles a valve sheds and how many cycles it lasts directly affect tool uptime and wafer defect counts.
- Customers
- Applied Materials, Lam Research, Tokyo Electron, ASML
- Share
- About 71% of the semiconductor and semiconductor-related vacuum valve market (2025)
- Founded
- 1965
- Ownership
- Public
- Revenue
- CHF 1,073,516 thousand (2025), about $1.29 billion
Advanced Energy Industries
Plasma power delivery and precision power
Makes the RF and DC power supplies and matching networks that strike and hold the plasmas used in etch and deposition, plus precision power for data-center equipment.
- Customers
- Applied Materials, Lam Research, Tokyo Electron, KLA
- Founded
- 1981
- Ownership
- Public
- Revenue
- $1,798.8 million (2025)
Comet Group
RF impedance matching and X-ray inspection
Makes RF power delivery components, vacuum capacitors and impedance matching networks for plasma tools, and X-ray systems used to inspect solder joints and packages.
- Customers
- Lam Research, Applied Materials, ASE
- Founded
- 1948
- Ownership
- Public
- Revenue
- CHF 457,044 thousand (2025), about $550 million
Edwards Vacuum
Dry vacuum pumps and abatement systems
Supplies the dry pumps that hold process chambers at vacuum and the abatement systems that destroy the toxic and greenhouse gases leaving them. A leading-edge fab runs thousands of pumps continuously.
- Customers
- TSMC, Samsung, Intel, Applied Materials, Lam Research
- Founded
- 1919
- Ownership
- Subsidiary of Atlas Copco
Ferrotec Holdingsフェローテックホールディングス
Quartz, ceramics, ferrofluidic seals and thermoelectrics
Supplies quartz and ceramic chamber consumables, ferrofluidic vacuum feedthroughs, electrostatic chucks and thermoelectric coolers, with much of its manufacturing in China.
- Customers
- Applied Materials, Lam Research, Naura, SMIC
- Founded
- 1980
- Ownership
- Public
- Revenue
- ¥288,933 million (year to March 2026), about $1.92 billion
Horiba株式会社堀場製作所
Mass flow controllers and in-line analysis
Supplies mass flow controllers, which meter process gases into chambers to within a fraction of a percent. It also supplies residual gas analyzers and liquid concentration monitors used across the fab.
- Customers
- Applied Materials, Lam Research, Tokyo Electron, TSMC
- Founded
- 1953
- Ownership
- Public
- Revenue
- ¥333,081 million (2025), about $2.23 billion
Ichor Holdings
Gas and fluid delivery subsystems
Designs and builds the gas panels, weldments and chemical delivery modules that route process gases into etch and deposition chambers. It is an outsourced manufacturing partner to the large tool vendors.
- Customers
- Lam Research, Applied Materials, ASML
- Founded
- 1999
- Ownership
- Public
- Revenue
- $947,652 thousand (2025)
Jenoptik
Optical systems and metrology components
Supplies precision optics, laser components and optical measurement modules used inside lithography and inspection tools, and makes its own micro-optics.
- Customers
- ASML, Carl Zeiss SMT, Applied Materials
- Founded
- 1991
- Ownership
- Public
- Revenue
- €1,045,973 thousand (2025), about $1.18 billion
MKS Instruments
RF power, flow control, lasers and plating chemistry
Supplies the RF generators, mass flow controllers, pressure gauges, vacuum components and ozone systems inside process tools. Through Atotech it also supplies the electroplating chemistry used for copper interconnect and substrates.
- Customers
- Applied Materials, Lam Research, Tokyo Electron, ASML
- Founded
- 1961
- Ownership
- Public
- Revenue
- $3,931 million (2025)
Pfeiffer Vacuum
Turbomolecular pumps and leak detection
Makes turbomolecular pumps, which spin at tens of thousands of revolutions per minute to reach the high vacuum that etch, deposition and EUV chambers require. It also makes leak detection instruments.
- Customers
- ASML, Applied Materials, Lam Research
- Founded
- 1890
- Ownership
- Majority owned by Busch Group
- Revenue
- €850,063 thousand (2025), about $960 million
Ultra Clean Holdings
Subsystem assembly and parts cleaning
Builds gas delivery systems, chemical modules and frame assemblies for process tools, and runs a large business cleaning and coating chamber parts between uses.
- Customers
- Applied Materials, Lam Research, Tokyo Electron
- Founded
- 1991
- Ownership
- Public
- Revenue
- $2,054.0 million (2025)
VDL Groep
Precision mechanical modules and frames
A Dutch precision manufacturing group that builds large mechanical modules, frames and vacuum assemblies for ASML scanners. It is one of the main suppliers in the Brainport cluster around ASML's base in Veldhoven.
- Customers
- ASML, Thermo Fisher Scientific
- Founded
- 1953
- Ownership
- Private, family-owned
Advanced Packaging & OSAT16 firms · 2 critical
Advanced Packaging & OSATDisco Corporation株式会社ディスコ
Wafer dicing, grinding and laser cutting
Makes the dicing saws, laser dicers and back-grinders that cut wafers into dies and thin them for stacking. HBM and other 3D stacks need wafers thinned to tens of micrometers.
- Customers
- TSMC, Samsung, SK hynix, ASE, Amkor
- Share
- 87% of the $1.9bn market for dicing saws and wafer grinders in 2025, on CSET's analysis of TechInsights data
- Founded
- 1937
- Ownership
- Public
- Revenue
- ¥436,889 million (year to March 2026), about $2.90 billion
- From China
- 30.9% of revenue, year to Mar 2026
Hanmi Semiconductor한미반도체
Thermocompression bonders for HBM
Makes the thermocompression bonders used to stack HBM dies, including dual-head models, and supplies SK hynix and Micron.
- Customers
- SK hynix, Micron, Samsung
- Founded
- 1980
- Ownership
- Public
Amkor Technology
OSAT assembly, test and advanced packaging
Packages and tests other companies' chips at plants across Asia. In its annual report for 2025 it described itself as the world's largest US-headquartered OSAT (outsourced semiconductor assembly and test firm). Its new advanced packaging plant in Peoria, Arizona, was planned under an October 2024 memorandum of understanding with TSMC to serve customers of TSMC's Arizona fabs. The two firms announced a long-term partnership in June 2026.
- Customers
- Apple, Nvidia, Qualcomm, Infineon, TSMC
- Founded
- 1968
- Ownership
- Public
- Revenue
- $6,707,981 thousand (2025)
ASE Technology Holding日月光投資控股
OSAT assembly, test and fan-out packaging
Packages and tests chips for fabless firms and foundries, and is adding 2.5D and fan-out capacity for AI parts. It calls itself the leading provider of semiconductor assembly and testing services. It absorbed Siliconware Precision Industries (SPIL) in 2018.
- Customers
- Nvidia, AMD, Qualcomm, Broadcom, MediaTek
- Share
- Revenue is for the whole group. About 59% of 2025 revenue came from packaging and test (NT$389.2bn) and about 40% from electronics manufacturing services, per its Q4 2025 6-K filing.
- Founded
- 1984
- Ownership
- Public, and includes Siliconware Precision Industries (SPIL)
- Revenue
- NT$645,387,710 thousand (2025), about $20.7 billion
ASMPTASM太平洋科技
Bonding, packaging and SMT equipment
Supplies die bonders, thermocompression bonders, wire bonders and surface mount equipment, and is one of the firms competing to supply hybrid bonders for advanced packaging.
- Customers
- TSMC, Intel, ASE, Amkor, SK hynix
- Founded
- 1975
- Ownership
- Public (Hong Kong listed), part-owned by ASM International
- Revenue
- HK$13,736,243 thousand (2025), about $1.76 billion
About the revenue figure. Continuing operations only. ASMPT has classified its NEXX business as held for sale.
BE Semiconductor Industries
Die bonding and hybrid bonding equipment
Makes die attach, flip chip and thermocompression bonders, and leads in hybrid bonding tools that join dies copper pad to copper pad without solder. Hybrid bonding is how logic dies are stacked in TSMC's SoIC and future HBM.
- Customers
- TSMC, Intel, Samsung, SK hynix, Amkor
- Founded
- 1995
- Ownership
- Public
- Revenue
- €591,331 thousand (2025), about $668 million
- From China
- 35.0% of revenue, FY2025
EV Group
Wafer bonding and nanoimprint lithography
Makes wafer bonding systems, including the fusion and hybrid bonding tools used for 3D integration, plus lithography systems for advanced packaging and photonics.
- Customers
- TSMC, Intel, Samsung, Sony, imec
- Founded
- 1980
- Ownership
- Private, family-owned
King Yuan Electronics京元電子
Wafer sort and final test services
Tests logic chips, including AI accelerators, both on the wafer (wafer sort) and after packaging (final test). In 2026 it described itself as the world's largest pure-play chip test house and second worldwide in test revenue.
- Customers
- Nvidia, MediaTek, Qualcomm, Broadcom
- Founded
- 1987
- Ownership
- Public
- Revenue
- NT$34,933,546 thousand (2025), about $1.12 billion
Kulicke and Soffa
Wire bonders and advanced assembly
Makes wire bonders, the standard tool of low-cost packaging, and is developing thermocompression and fluxless bonding systems for advanced packages.
- Customers
- ASE, Amkor, JCET, Micron
- Founded
- 1951
- Ownership
- Public
- Revenue
- $654,081 thousand (year to September 2025)
Powertech Technology力成科技
Memory packaging and test
Specializes in memory assembly and test, including DRAM and NAND packaging, and has been adding capacity for HBM-related and logic advanced packaging work.
- Customers
- Micron, Kioxia, SK hynix, Nvidia
- Founded
- 1997
- Ownership
- Public
- Revenue
- NT$74,929,320 thousand (2025), about $2.40 billion
SUSS MicroTec
Coaters, bonders and packaging lithography
Supplies photoresist coaters, developers, mask aligners and temporary bonding systems used in advanced packaging and MEMS, including the thick-resist processing that redistribution layers need.
- Customers
- TSMC, ASE, Amkor, Intel
- Founded
- 1949
- Ownership
- Public
- Revenue
- €503,180 thousand (2025), about $569 million
Hua Tian Technology华天科技
OSAT assembly and test
A Chinese OSAT that ranks among the ten largest in the world. It provides wire bond, flip chip and fan-out packaging from plants in Tianshui, Xi'an, Kunshan and Nanjing. It also packages chips through Unisem, a Malaysian firm it acquired in 2019.
- Customers
- Chinese fabless firms, Automotive and consumer OEMs
- Founded
- 2003
- Ownership
- Public (Shenzhen), state-linked
- Revenue
- CN¥17,213,915,293.79 (2025), about $2.39 billion
JCET Group长电科技
OSAT assembly, test and fan-out packaging
A leading Chinese assembly and test firm, offering wire bond, flip chip, fan-out and system-in-package assembly. Its revenue reached a record RMB 38.87 billion in 2025. It acquired STATS ChipPAC in 2015 to gain advanced packaging capability.
- Customers
- Chinese fabless firms, SMIC, Global IDMs
- Founded
- 1972
- Ownership
- Public (Shanghai), with state-linked shareholders
- Revenue
- CN¥38,871,348,331.23 (2025), about $5.41 billion
Tongfu Microelectronics通富微电
OSAT assembly and test, AMD partner
A Chinese OSAT that packages a large share of AMD's CPUs and GPUs through joint venture plants acquired from AMD in 2016. It is developing 2.5D chiplet packaging.
- Customers
- AMD, Chinese fabless firms
- Founded
- 1997
- Ownership
- Public (Shenzhen), with AMD holding a stake in its Suzhou and Penang plants
- Revenue
- CN¥27,921,424,656.15 (2025), about $3.88 billion
Chipbond Technology頎邦科技
Gold bumping and display driver packaging
Specializes in gold and copper bumping and chip-on-film packaging, mainly for display driver ICs, and provides bumping services used in wider advanced packaging flows.
- Customers
- Novatek, Himax, Chinese panel makers
- Founded
- 1997
- Ownership
- Public
- Revenue
- NT$21,454,104 thousand (2025), about $688 million
UTAC Holdings
OSAT assembly and test
A Singapore-based OSAT providing assembly and test for analog, mixed-signal, automotive and memory devices from plants across Southeast Asia and China.
- Customers
- Analog and automotive IDMs, Fabless customers
- Founded
- 1997
- Ownership
- Private, owned by Wise Road Capital
Substrates & PCBs17 firms · 2 critical
Substrates & PCBsAjinomoto味の素株式会社
ABF build-up film dielectric
Makes Ajinomoto Build-up Film (ABF), the insulating layer between the copper layers of flip-chip package substrates. Ajinomoto, a food company, developed the material from its amino acid chemistry. It says ABF holds over 95 percent of its market.
- Customers
- Ibiden, Shinko Electric, Unimicron, AT&S, Nan Ya PCB
- Share
- Over 95% of the ABF build-up film market, per Ajinomoto's June 2026 electronic materials briefing
- Founded
- 1909
- Ownership
- Public
- Revenue
- ¥1,583,719 million (year to March 2026), about $10.5 billion
Nittobo日東紡績株式会社
Low-CTE T-glass fiber and glass cloth
Weaves the ultra-fine low thermal expansion glass cloth, known as T-glass, that reinforces high-end package substrates and server boards. Its fiber keeps large substrates flat as they heat. In August 2025 it decided to expand glass fiber cloth production at its Fukushima Enterprise Center, with the added output starting in the fourth quarter of its fiscal 2026. It says Chinese and Taiwanese companies are aggressively catching up with it in special glass.
- Customers
- Ibiden, Shinko Electric, Unimicron, Mitsubishi Gas Chemical
- Founded
- 1923
- Ownership
- Public
AT&S
IC substrates and high-end PCBs
Makes IC substrates and advanced PCBs, with ABF substrate plants in Chongqing, China, and Kulim, Malaysia. It is the only European firm in high-end IC substrates.
- Customers
- Intel, AMD, Nvidia, Apple
- Founded
- 1987
- Ownership
- Public
- Revenue
- €1,790,776 thousand (year to March 2026), about $2.08 billion
Gold Circuit Electronics金像電子
Server and networking PCBs
Makes high-layer-count printed circuit boards for servers and networking, and has grown with AI server baseboard and switch board demand.
- Customers
- Foxconn, Quanta, Wiwynn, Celestica
- Founded
- 1979
- Ownership
- Public
- Revenue
- NT$60,003,758 thousand (2025), about $1.92 billion
Ibidenイビデン株式会社
FC-BGA package substrates
Makes the highest-layer-count flip-chip BGA substrates, the multilayer boards a processor die sits on. It supplies substrates for large AI packages and is expanding capacity, first mainly at its Gama plant, which it said in August 2026 would start operating in stages from the end of fiscal 2027.
- Customers
- Nvidia, Intel, AMD, Broadcom
- Founded
- 1912
- Ownership
- Public
- Revenue
- ¥416,201 million (year to March 2026), about $2.76 billion
Kinsus Interconnect景碩科技
IC substrates and flexible circuits
Makes flip-chip and wire bond IC substrates and flexible printed circuits, supplying processor and networking chip customers from plants in Taiwan and China.
- Customers
- Intel, AMD, Broadcom, Marvell
- Founded
- 2000
- Ownership
- Public, affiliated with Pegatron
- Revenue
- NT$39,351,096 thousand (2025), about $1.26 billion
LG Innotek엘지이노텍
FC-BGA substrates and camera modules
Entered high-end flip-chip BGA substrates in 2022 with a plant in Gumi, adding a third Korean source alongside Samsung Electro-Mechanics. Its larger business is optical modules for smartphones.
- Customers
- Intel, Nvidia, Apple
- Founded
- 1970
- Ownership
- Public, part of the LG group
- Revenue
- ₩21,896,603 million (2025), about $15.4 billion
Mitsubishi Gas Chemical三菱瓦斯化学株式会社
BT resin and copper-clad laminates
Invented BT resin, the laminate material used in memory and many package substrates, and supplies copper-clad laminates and specialty chemicals for electronics. In October 2024 it estimated that its BT resins held about 40 percent of the substrate materials market. It also promotes a low-warpage copper-clad laminate for flip-chip BGA substrates, which carry CPUs and GPUs.
- Customers
- Package substrate makers
- Founded
- 1918
- Ownership
- Public
- Revenue
- ¥738,243 million (year to March 2026), about $4.90 billion
Nan Ya PCB南亞電路板
ABF substrates and printed circuit boards
Produces ABF and BT IC substrates and high-layer-count printed circuit boards, and is one of the main IC substrate makers worldwide.
- Customers
- Nvidia, Intel, AMD, Broadcom
- Founded
- 1997
- Ownership
- Public, part of the Formosa Plastics Group
- Revenue
- NT$40,172,990 thousand (2025), about $1.29 billion
Panasonic Industryパナソニック インダストリー
Copper-clad laminates and electronic materials
Makes the Megtron series of low-loss copper-clad laminates used in high-speed server and switch boards. At 112 Gbps, too much signal loss in the board makes a link fail.
- Customers
- Foxconn, Quanta, Wistron, Celestica, Arista
- Founded
- 1918
- Ownership
- Division of Panasonic Holdings
Samsung Electro-Mechanics삼성전기
FC-BGA substrates and MLCCs
Makes flip-chip BGA substrates for processors and AI accelerators, plus multilayer ceramic capacitors (MLCCs) used in dense server power delivery. It is expanding FC-BGA capacity in Busan and Vietnam.
- Customers
- Nvidia, AMD, Intel, Samsung, Apple
- Founded
- 1973
- Ownership
- Public, part of the Samsung group
- Revenue
- ₩11,314,459,238,100 (2025), about $7.96 billion
Shinko Electric Industries新光電気工業
FC-BGA substrates and lead frames
Makes high-end flip-chip BGA substrates, plus lead frames and interposers. Other Japanese makers of high-end substrates include Ibiden and Toppan. It was taken private in 2025 by a company owned mainly by funds of JIC Capital, a subsidiary of Japan Investment Corporation. In September 2026 Shinko agreed to buy Japan Display's Mobara plant in Chiba as a new core plant for its flip-chip package substrates. Production there is scheduled for fiscal 2028.
- Customers
- Intel, Nvidia, AMD, Broadcom
- Founded
- 1946
- Ownership
- Taken private in 2025 by a consortium led by the Japan Investment Corporation
- Revenue
- ¥215,022 million (year to March 2025), about $1.41 billion
About the revenue figure. Shinko has been private since June 2025. This is its last published consolidated figure, from an unaudited results release.
TTM Technologies
PCBs and RF components
Makes printed circuit boards for data center, aerospace and defense customers, including high-layer-count boards for AI and networking systems. By its own description it is one of the largest technology manufacturers in North America. It also offers IC substrates and is building an ultra-high-density circuit board plant in Syracuse, New York, with volume production expected in the second half of 2026.
- Customers
- Cisco, Arista, Defense primes, Hyperscale operators
- Founded
- 1978
- Ownership
- Public
- Revenue
- $2,906,345 thousand (2025)
Unimicron欣興電子
IC substrates and HDI boards
One of the largest IC substrate makers, producing ABF and BT substrates plus high density interconnect boards. It is adding ABF capacity in Taiwan and Shenzhen for AI demand.
- Customers
- Nvidia, AMD, Intel, Broadcom, MediaTek
- Founded
- 1990
- Ownership
- Public, part of the United Microelectronics group
- Revenue
- NT$131,240,882 thousand (2025), about $4.21 billion
Absolics
Glass core substrates
A subsidiary of Korea's SKC with a final CHIPS Act award of up to $75 million for a 120,000-square-foot glass core substrate plant in Covington, Georgia. As of October 2026, NIST's project page expected the plant's production capacity to come online in 2027. NIST says the glass substrates allow smaller, more densely packed and shorter connections, for faster and more energy-efficient computing.
- Customers
- Undisclosed customers
- Founded
- 2021
- Ownership
- Subsidiary of SKC, part of SK Group
Victory Giant Technology胜宏科技
High-multilayer PCBs for AI servers
Makes high-layer-count printed circuit boards and supplies AI accelerator baseboards and switch boards to the server ODMs.
- Customers
- Nvidia, Foxconn, Quanta, Celestica
- Founded
- 2006
- Ownership
- Public (Shenzhen ChiNext)
- Revenue
- CN¥19,292,313,457.36 (2025), about $2.68 billion
WUS Printed Circuit沪电股份
High-speed PCBs for servers and networking
Makes high-speed multilayer printed circuit boards for servers, switches and AI accelerators, and is a main supplier to networking equipment makers.
- Customers
- Nvidia, Cisco, Arista, Foxconn
- Founded
- 1992
- Ownership
- Public (Shenzhen)
- Revenue
- CN¥18,945,220,585 (2025), about $2.64 billion
AI Accelerator Vendor28 firms · 1 critical
AI Accelerator VendorNvidia
Merchant GPUs and rack-scale AI systems
Designs the Blackwell and Rubin GPUs, the NVLink connections that join many GPUs into one system, and the NVL72 rack systems. Most AI training and a large share of inference run on this hardware. It also makes the CUDA software stack that ties developers to its hardware.
- Customers
- Microsoft, Meta, Amazon, Google, Oracle, CoreWeave
- Founded
- 1993
- Ownership
- Public
- Revenue
- $215,938 million (year to January 2026)
- From China
- 9.1% of revenue, year to Jan 2026
Alchip Technologies世芯電子
ASIC design services and backend implementation
A design services firm that takes a customer's AI accelerator design through physical layout, tape-out and supply at TSMC, including 2.5D packaging. It is one of the few firms with production experience on reticle-limit AI dies, the largest chips a lithography tool can print in one exposure.
- Customers
- Amazon, Intel, Socionext, AMD
- Founded
- 2003
- Ownership
- Public
- Revenue
- NT$30,926,092 thousand (2025), about $992 million
AMD
Merchant GPUs, server CPUs and rack systems
Designs the Instinct MI355X and MI400 accelerators and EPYC server CPUs. Since buying ZT Systems in 2025 it also designs rack-scale AI systems. It is the only company other than Nvidia that sells AI accelerators on the open market at scale.
- Customers
- Meta, Microsoft, Oracle, OpenAI, Dell, HPE
- Founded
- 1969
- Ownership
- Public
- Revenue
- $34,639 million (2025)
- From China
- 22.4% of revenue, FY2025
Annapurna Labs
Hyperscaler in-house training and inference silicon
Amazon's chip design arm. It designs the Trainium training chips, Inferentia inference chips and the Nitro data processing units used across AWS. Trainium 3 is the current generation.
- Customers
- Amazon Web Services, Anthropic
- Founded
- 2011
- Ownership
- Subsidiary of Amazon since 2015
Broadcom
Custom AI ASICs (XPUs) plus Ethernet switch silicon
Co-designs and supplies the custom AI accelerators used by Google, Meta and other hyperscalers. It is also a leading seller of Ethernet switch chips, including its Tomahawk and Jericho lines, and it supplies the PCIe and SerDes IP that connect AI clusters.
- Customers
- Google, Meta, OpenAI, ByteDance, Arista, Cisco
- Founded
- 1961
- Ownership
- Public
- Revenue
- $63,887 million (year to October 2025)
Global Unichip創意電子
ASIC design services, TSMC-affiliated
TSMC's design services affiliate. It does the physical design and IP integration for customers' custom AI chips (ASICs) and delivers the finished chips, made on TSMC processes and packaging. Its ties to TSMC give it early access to new processes.
- Customers
- Google, Microsoft, Tesla, NXP
- Founded
- 1998
- Ownership
- Public, with TSMC as the largest shareholder
- Revenue
- NT$34,140,978 thousand (2025), about $1.10 billion
Google
Hyperscaler in-house TPU
Designs the Tensor Processing Unit (TPU), and announced the eighth generation, the TPU 8t and TPU 8i, in April 2026. It uses TPUs in its own data centers and offers them to cloud customers. Broadcom and MediaTek work with it on the physical design, which turns a chip design into a layout, and on manufacturing at TSMC.
- Customers
- Google DeepMind, Google Cloud, Anthropic, Apple
- Founded
- 1998
- Ownership
- Division of Alphabet Inc.
Intel
Server CPUs and AI accelerators
Designs Xeon server CPUs and the Gaudi accelerator line. Xeon chips are still the host CPUs in most AI clusters. Its product business is separate from Intel Foundry, the company's manufacturing arm.
- Customers
- Dell, HPE, Supermicro, Amazon, IBM
- Founded
- 1968
- Ownership
- Public, and the US government took a large equity stake in 2025
- Revenue
- $52,853 million (2025)
Marvell Technology
Custom AI silicon, optical DSPs and interconnect
Designs custom AI accelerators and infrastructure chips for hyperscalers, plus networking chips such as optical DSPs, retimers and Ethernet controllers for AI clusters. It ranks second to Broadcom in custom AI chips and competes with it directly to design hyperscalers' accelerators.
- Customers
- Amazon, Microsoft, Google, Meta
- Founded
- 1995
- Ownership
- Public
- Revenue
- $8,194.6 million (year to January 2026)
MediaTek聯發科技
Custom ASIC and mobile SoCs
Best known for its smartphone chips, MediaTek also designs custom AI chips (ASICs) and works on Google's TPU program. It has experience designing high-volume chips on advanced nodes.
- Customers
- Google, Meta, Xiaomi, Samsung
- Founded
- 1997
- Ownership
- Public
- Revenue
- NT$595,965,682 thousand (2025), about $19.1 billion
Biren Technology壁仞科技
General-purpose GPUs for AI training
Designs the BR100 series general-purpose GPUs for AI training and high-performance computing. Export controls forced it to redesign its chips so they no longer use TSMC's most advanced processes.
- Customers
- Chinese cloud operators, Chinese research institutes
- Founded
- 2019
- Ownership
- Public (Hong Kong), on the US Entity List
- Revenue
- CN¥1,034,614 thousand (2025), about $144 million
Cambricon Technologies寒武纪
Merchant AI training and inference chips
Designs the Siyuan training and inference accelerators and sells them to Chinese cloud operators. Among listed Chinese companies that design AI chips for sale to other firms, it is the largest. It is on the US Entity List, which restricts US exports to it, and has its chips made in China.
- Customers
- ByteDance, Alibaba, China Mobile, Lenovo
- Founded
- 2016
- Ownership
- Public (Shanghai STAR Market), with state-linked shareholders
- Revenue
- CN¥6,497,196,198.68 (2025), about $904 million
Cerebras Systems
Wafer-scale AI processors
Builds the Wafer Scale Engine, a single processor that covers almost an entire 300 mm wafer. It keeps its memory on the chip as SRAM instead of using separate HBM stacks. It sells systems and inference cloud capacity.
- Customers
- G42, Mayo Clinic, Argonne National Laboratory, Meta
- Founded
- 2016
- Ownership
- Public
- Revenue
- $509,991 thousand (2025)
About the revenue figure. Cerebras listed in May 2026, so the figure comes from its listing prospectus.
d-Matrix
Digital in-memory compute inference accelerators
Builds inference accelerators that compute inside SRAM, which cuts the energy spent moving model weights. They are aimed at batch inference, which runs many requests to a large language model at once.
- Customers
- Microsoft (evaluation), Enterprise inference customers
- Founded
- 2019
- Ownership
- Private, venture-backed
Etched
Transformer-specific ASIC
Designing Sohu, a custom chip (ASIC) that hard-wires the transformer architecture into silicon. The transformer is the model design behind large language models. Sohu gives up flexibility to do more work per watt.
- Customers
- Early access inference customers
- Founded
- 2022
- Ownership
- Private, venture-backed
FuriosaAI퓨리오사AI
Inference accelerators
Builds the RNGD inference accelerator, which uses HBM3 memory and an architecture designed around tensor contraction, the core math of AI models. It is aimed at companies running inference where power is limited. It turned down an acquisition offer from Meta in 2025.
- Customers
- LG AI Research, Korean enterprises
- Founded
- 2017
- Ownership
- Private, venture-backed
Groq
Deterministic inference accelerators (LPU)
Designs the Language Processing Unit (LPU), an inference chip that uses large on-chip SRAM and no HBM, and whose compiler schedules every operation in advance. It sells few chips. Instead it runs AI models in its own cloud and charges customers per token of text processed.
- Customers
- Bell Canada, Saudi Arabia (Aramco Digital), Enterprise and API customers
- Founded
- 2016
- Ownership
- Private, venture-backed, and licensed its inference technology to Nvidia on a non-exclusive basis in December 2025
HiSilicon海思半导体
Ascend AI accelerators
Huawei's chip design arm. It designs the Ascend 910C and the announced 950 and 960 accelerators. SMIC makes its chips without EUV lithography tools, and that limits yield and volume.
- Customers
- Huawei, China Mobile, China Telecom, iFlytek
- Founded
- 2004
- Ownership
- Subsidiary of Huawei Technologies
Hygon Information Technology海光信息
x86 server CPUs and DCU accelerators
Makes x86-compatible server CPUs, derived from an AMD license, and the Deep Computing Unit (DCU) accelerator line. It supplies Chinese government and state enterprise data centers.
- Customers
- Sugon, China Telecom, Chinese government data centers
- Founded
- 2014
- Ownership
- Public (Shanghai STAR Market), state-linked, and its planned merger with Sugon was terminated in December 2025
- Revenue
- CN¥14,376,889,476.95 (2025), about $2.00 billion
Iluvatar CoreX天数智芯
GPGPU for AI training and inference
Designs the Tiangai and Zhikai general-purpose AI accelerators for Chinese data centers, built to work with mainstream AI frameworks.
- Customers
- Chinese cloud operators, Chinese universities
- Founded
- 2015
- Ownership
- Public (Hong Kong)
- Revenue
- CN¥1,033,606 thousand (2025), about $144 million
Meta Platforms
Hyperscaler in-house inference accelerator
Designs the MTIA inference accelerator for its recommendation and ranking workloads, built with Broadcom at TSMC. Meta is also one of the largest buyers of GPUs from outside chip vendors.
- Customers
- Meta Platforms
- Founded
- 2004
- Ownership
- Public
MetaX沐曦集成电路
GPGPU for training and inference
A Chinese designer of general-purpose GPUs, whose Xiyun and Xisi lines are built for AI training and inference in Chinese data centers. It offers a CUDA-compatible software stack.
- Customers
- Chinese cloud operators, Domestic server OEMs
- Founded
- 2020
- Ownership
- Public (Shanghai STAR Market)
- Revenue
- CN¥1,644,085,465.86 (2025), about $229 million
Microsoft Azure Silicon
Hyperscaler in-house accelerator
Designs the Maia accelerator family and the Cobalt Arm server CPU for Microsoft's Azure cloud. It also designs the 'sidekick' racks that sit beside the servers and supply the liquid cooling they need. Maia 200 is the current generation.
- Customers
- Microsoft Azure, OpenAI
- Founded
- 1975
- Ownership
- Division of Microsoft Corporation
Moore Threads摩尔线程
General-purpose GPUs for graphics and AI
Builds full-function GPUs with a CUDA-like software layer, aimed at replacing Nvidia in Chinese workstations and training clusters. It listed on Shanghai's STAR Market after being placed on the US Entity List.
- Customers
- Chinese cloud operators, Chinese universities, Domestic OEMs
- Founded
- 2020
- Ownership
- Public (Shanghai STAR Market), on the US Entity List
- Revenue
- CN¥1,505,525,060.52 (2025), about $209 million
Rebellions리벨리온
Inference accelerators
An AI chip startup building the Rebel inference accelerator with Samsung Foundry and SK hynix HBM. It is the national champion for Korean AI silicon.
- Customers
- SK Telecom, KT, Korean public sector
- Founded
- 2020
- Ownership
- Private, merged with SK Telecom's Sapeon in 2024, with SK Group and Arm as investors
SambaNova Systems
Reconfigurable dataflow accelerators
Builds reconfigurable dataflow units, AI chips that are set up to match how data flows through each model. They use a large three-tier memory system. SambaNova sells them as an inference cloud service and as full systems for companies that want to run models on their own premises.
- Customers
- Argonne National Laboratory, SoftBank, Saudi Aramco
- Founded
- 2017
- Ownership
- Private, venture-backed
Tenstorrent
RISC-V AI processors and licensable IP
Builds AI accelerators around RISC-V cores, with Ethernet links that join many chips into one system. It also licenses the designs as IP so customers can build their own chips.
- Customers
- LG Electronics, Hyundai, Rapidus, Bodhi Computing
- Founded
- 2016
- Ownership
- Private, with investors including Samsung, Hyundai and LG
Qualcomm
Edge AI SoCs and data-center inference accelerators
Designs Snapdragon chips with built-in neural engines that run AI on phones and other devices. In 2025 it announced the AI200 and AI250 rack-scale inference accelerators. Its purchase of Alphawave added the high-speed connection (SerDes) IP a data-center chip needs.
- Customers
- Humain, Samsung, Xiaomi, Meta
- Founded
- 1985
- Ownership
- Public
- Revenue
- $44,284 million (year to September 2025)
What each country makes
Each country's firms are counted under the country of the firm's own headquarters.
- United States
- Designs the chips, makes most of the tools and is the biggest buyer.
- Japan
- Wafers, photoresist, masks and etch tools, which every fab needs.
- Taiwan
- Makes nearly every leading-edge chip and packages most of them.
- South Korea
- Memory, including the high-bandwidth stacks every accelerator needs.
- Netherlands
- The only maker of EUV scanners, the machines that print the finest layers.
- China
- The largest market, now building its own tools, memory and chips.
- Germany
- The optics inside every EUV scanner, and specialty chemicals.
- Israel
- Metrology and inspection tools, and chip design centers.
- Austria
- The mask writers and substrates that two extreme chokepoints depend on.
- Malaysia
- Test and assembly, the last stage before the server.
- Singapore
- Test, assembly and mature-node fabs.
- United Kingdom
- Arm and the other processor designs that most chips license.